Inventor · disambiguated record
Daoqiang Lu
Also filed as: BRAUNISCH HENNING · GEORGE LEGAL REPRESENTATIVE AN · LU DAOQIANG · LU DAOQIANG DANIEL
90 granted patents·40 pending applications·1,636 citations·filing 2000–2025
99Inventor score
Top patents by PatentIndex Score
130 records- 0198US7432592B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2005·Granted Oct 7, 2008·294 cites·9 claims
- 0297US9708518B2Optical transparent dual cure adhesives compositionHENKEL AG & CO KGAA·Filed 2015·Granted Jul 18, 2017·6 cites·9 claims
- 0397US7659143B2Dual-chip integrated heat spreader assembly, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted Feb 9, 2010·71 cites·18 claims
- 0496US7554203B2Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufactureINTEL CORP·Filed 2006·Granted Jun 30, 2009·65 cites·15 claims
- 0596US7373033B2Chip-to-chip optical interconnectINTEL CORP·Filed 2006·Granted May 13, 2008·67 cites·19 claims
- 0695US7023089B1Low temperature packaging apparatus and methodINTEL CORP·Filed 2004·Granted Apr 4, 2006·89 cites·35 claims
- 0794US8063482B2Heat spreader as mechanical reinforcement for ultra-thin dieLU DAOQIANG·Filed 2006·Granted Nov 22, 2011·24 cites·16 claims
- 0894US7723164B2Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 25, 2010·32 cites·23 claims
- 0994US7344383B1Split socket optical interconnectINTEL CORP·Filed 2006·Granted Mar 18, 2008·33 cites·17 claims
- 1094US7251389B2Embedded on-die laser source and optical interconnectINTEL CORP·Filed 2005·Granted Jul 31, 2007·46 cites·21 claims
- 1193US7393468B2Adhesive with differential optical properties and its application for substrate processingINTEL CORP·Filed 2005·Granted Jul 1, 2008·20 cites·5 claims
- 1293US7226812B2Wafer support and release in wafer processingINTEL CORP·Filed 2004·Granted Jun 5, 2007·63 cites·26 claims
- 1392US7720337B2Wafer based optical interconnectINTEL CORP·Filed 2007·Granted May 18, 2010·29 cites·17 claims
- 1491US7288438B2Solder deposition on wafer backside for thin-die thermal interface materialINTEL CORP·Filed 2005·Granted Oct 30, 2007·18 cites·24 claims
- 1590US7684660B2Methods and apparatus to mount a waveguide to a substrateINTEL CORP·Filed 2005·Granted Mar 23, 2010·34 cites·21 claims
- 1690US7068892B1Passively aligned optical-electrical interfaceINTEL CORP·Filed 2005·Granted Jun 27, 2006·26 cites·21 claims
- 1790US6834133B1Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrateINTEL CORP·Filed 2003·Granted Dec 21, 2004·41 cites·31 claims
- 1889US8642386B2Heat spreader as mechanical reinforcement for ultra-thin dieLU DAOQIANG·Filed 2011·Granted Feb 4, 2014·8 cites·11 claims
- 1989US7534715B2Methods including fluxless chip attach processesINTEL CORP·Filed 2005·Granted May 19, 2009·22 cites·25 claims
- 2089US7334946B2Passively aligned optical-electrical interface with microlensesINTEL CORP·Filed 2005·Granted Feb 26, 2008·19 cites·17 claims
- 2189US7303944B2Microelectronic devices having underfill materials with improved fluxing agentsINTEL CORP·Filed 2006·Granted Dec 4, 2007·10 cites·17 claims
- 2289US7279362B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2005·Granted Oct 9, 2007·18 cites·8 claims
- 2389US7061099B2Microelectronic package having chamber sealed by material including one or more intermetallic compoundsINTEL CORP·Filed 2004·Granted Jun 13, 2006·50 cites·24 claims
- 2488US7009289B2Fluxless die-to-heat spreader bonding using thermal interface materialINTEL CORP·Filed 2004·Granted Mar 7, 2006·39 cites·17 claims
- 2588US6792179B2Optical thumbtackINTEL CORP·Filed 2002·Granted Sep 14, 2004·35 cites·31 claims
- 2688US6344157B1Conductive and resistive materials with electrical stability for use in electronics devicesNAT STARCH CHEM INVEST·Filed 2001·Granted Feb 5, 2002·52 cites·20 claims
- 2787US6740192B1Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethaneGEORGIA TECH RES INST·Filed 2000·Granted May 25, 2004·28 cites·6 claims
- 2886US8193072B2Semiconductor wafer coat layers and methods thereforLI ERIC J·Filed 2010·Granted Jun 5, 2012·9 cites·9 claims
- 2986US8012808B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2008·Granted Sep 6, 2011·15 cites·12 claims
- 3086US7435664B2Wafer-level bonding for mechanically reinforced ultra-thin dieINTEL CORP·Filed 2006·Granted Oct 14, 2008·12 cites·9 claims
- 3186US7038316B2Bumpless die and heat spreader lid module bonded to bumped die carrierINTEL CORP·Filed 2004·Granted May 2, 2006·34 cites·14 claims
- 3285US10717907B2Photo-curable adhesive composition, preparation and use thereofHENKEL AG & CO KGAA·Filed 2017·Granted Jul 21, 2020·4 cites·16 claims
- 3385US7256059B2Underfill integration for optical packagesINTEL CORP·Filed 2005·Granted Aug 14, 2007·11 cites·20 claims
- 3483US7675182B2Die warpage controlINTEL CORP·Filed 2007·Granted Mar 9, 2010·12 cites·10 claims
- 3582US7476568B2Wafer-level assembly of heat spreaders for dual IHS packagesINTEL CORP·Filed 2006·Granted Jan 13, 2009·6 cites·8 claims
- 3682US6833289B2Fluxless die-to-heat spreader bonding using thermal interface materialINTEL CORP·Filed 2003·Granted Dec 21, 2004·27 cites·16 claims
- 3781US10308846B2Ultra-violet-curable and moisture-curable adhesive compositionHENKEL AG & CO KGAA·Filed 2014·Granted Jun 4, 2019·2 cites·17 claims
- 3881US7703991B2Flip-chip mountable optical connector for chip-to-chip optical interconnectabilityINTEL CORP·Filed 2005·Granted Apr 27, 2010·10 cites·7 claims
- 3979US7897486B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2007·Granted Mar 1, 2011·7 cites·7 claims
- 4079US7236666B2On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical deviceINTEL CORP·Filed 2004·Granted Jun 26, 2007·19 cites·16 claims
- 4178US8541876B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2005·Granted Sep 24, 2013·7 cites·19 claims
- 4278US7407085B2Apparatus and method for attaching a semiconductor die to a heat spreaderINTEL CORP·Filed 2004·Granted Aug 5, 2008·28 cites·21 claims
- 4378US7177504B2Manufacturable connectorization process for optical chip-to-chip interconnectsINTEL CORP·Filed 2004·Granted Feb 13, 2007·18 cites·32 claims
- 4477US10093837B2Process for binding substrates with a liquid optically clear photo-curable adhesiveHenkel IP & Holding GmbH·Filed 2014·Granted Oct 9, 2018·3 cites·20 claims
- 4577US8230589B2Method of mounting an optical deviceLU DAOQIANG·Filed 2008·Granted Jul 31, 2012·8 cites·17 claims
- 4677US7372120B1Methods and apparatus to optically couple an optoelectronic chip to a waveguideINTEL CORP·Filed 2003·Granted May 13, 2008·16 cites·31 claims
- 4776US9783713B2Dual-curable adhesive composition, use thereof, and process for bonding substratesHENKEL (CHINA) COMPANY LTD·Filed 2014·Granted Oct 10, 2017·1 cites·17 claims
- 4875US9508675B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2013·Granted Nov 29, 2016·3 cites·27 claims
- 4975US7939922B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2009·Granted May 10, 2011·4 cites·6 claims
- 5075US7564066B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2005·Granted Jul 21, 2009·5 cites·11 claims
Showing the top 50 of 130 patent records by PatentIndex Score.
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