Inventor · disambiguated record
Suryadevara V. Babu
Also filed as: BABU SURYADEVARA · BABU SURYADEVARA V · BABU SURYADEVARA VIJAYAKUMAR
31 granted patents·13 pending applications·641 citations·filing 1985–2025
98Inventor score
Top patents by PatentIndex Score
44 records- 0195US6491843B1Slurry for chemical mechanical polishing silicon dioxideEASTMAN KODAK CO·Filed 2000·Granted Dec 10, 2002·92 cites·10 claims
- 0294US6544892B2Slurry for chemical mechanical polishing silicon dioxideEASTMAN KODAK CO·Filed 2002·Granted Apr 8, 2003·88 cites·13 claims
- 0393US11545365B2Chemical planarizationCHEMPOWER CORP·Filed 2020·Granted Jan 3, 2023·5 cites·13 claims
- 0485US6702954B1Chemical-mechanical polishing slurry and methodFERRO CORP·Filed 2000·Granted Mar 9, 2004·32 cites·17 claims
- 0584US8822340B2Abrasive compositions for chemical mechanical polishing and methods for using sameRHODIA OPERATIONS·Filed 2013·Granted Sep 2, 2014·7 cites·23 claims
- 0684US6627107B2Slurry for chemical mechanical polishing silicon dioxideEASTMAN KODAK CO·Filed 2002·Granted Sep 30, 2003·23 cites·7 claims
- 0783US7279119B2Silica and silica-based slurryPPG IND OHIO INC·Filed 2003·Granted Oct 9, 2007·31 cites·19 claims
- 0883US7091164B2Slurry for chemical mechanical polishing silicon dioxideUNIV CLARKSON·Filed 2003·Granted Aug 15, 2006·22 cites·6 claims
- 0982US8366959B2Abrasive compositions for chemical mechanical polishing and methods for using sameRHODIA OPERATIONS·Filed 2009·Granted Feb 5, 2013·9 cites·19 claims
- 1079US6468910B1Slurry for chemical mechanical polishing silicon dioxideFiled 1999·Granted Oct 22, 2002·44 cites·1 claims
- 1177US6918820B2Polishing compositions comprising polymeric cores having inorganic surface particles and method of useEASTMAN KODAK CO·Filed 2003·Granted Jul 19, 2005·19 cites·32 claims
- 1276US5674621AFuser members with an outermost layer of a fluorinated diamond like carbonEASTMAN KODAK CO·Filed 1996·Granted Oct 7, 1997·35 cites·15 claims
- 1374US9097994B2Abrasive-free planarization for EUV mask substratesBABU SURYADEVARA V·Filed 2013·Granted Aug 4, 2015·7 cites·12 claims
- 1473US7723234B2Method for selective CMP of polysiliconUNIV CLARKSON·Filed 2006·Granted May 25, 2010·6 cites·16 claims
- 1569US7101800B2Chemical-mechanical polishing slurry and methodFERRO CORP·Filed 2003·Granted Sep 5, 2006·11 cites·19 claims
- 1668US4599134APlasma etching with tracerIBM·Filed 1985·Granted Jul 8, 1986·23 cites·12 claims
- 1765US6007954AElectrophotographic apparatus with improved blue sensitivityEASTMAN KODAK CO·Filed 1998·Granted Dec 28, 1999·16 cites·20 claims
- 1865US4956197APlasma conditioning of a substrate for electroless platingIBM·Filed 1988·Granted Sep 11, 1990·23 cites·15 claims
- 1964US5061359APlasma processing apparatus including three bus structuresIBM·Filed 1990·Granted Oct 29, 1991·26 cites·3 claims
- 2064US2024391050A1Pads for chemical planarizationCHEMPOWER CORP·Filed 2024·Application pending·0 cites
- 2163US5849443AMethod of making multilayer electrophotographic elementsEASTMAN KODAK CO·Filed 1998·Granted Dec 15, 1998·15 cites·9 claims
- 2261US2025381640A1Abrasive-free planarization of polycrystalline siliconCHEMPOWER CORP·Filed 2025·Application pending·0 cites
- 2360US2025091176A1Chemical planarization of non-metallic materialsCHEMPOWER CORP·Filed 2024·Application pending·0 cites
- 2459US7553430B2Polishing slurries and methods for chemical mechanical polishingCLIMAX ENGINEERED MAT LLC·Filed 2006·Granted Jun 30, 2009·1 cites·12 claims
- 2559US4718972AMethod of removing seed particles from circuit board substrate surfaceIBM·Filed 1986·Granted Jan 12, 1988·21 cites·8 claims
- 2658US5849445AMultilayer photoconductive elements having low dark decayEASTMAN KODAK CO·Filed 1998·Granted Dec 15, 1998·12 cites·17 claims
- 2757US4810326AInterlaminate adhesion between polymeric materials and electrolytic copper surfacesIBM·Filed 1987·Granted Mar 7, 1989·18 cites·8 claims
- 2857US4618477AUniform plasma for drill smear removal reactorIBM·Filed 1985·Granted Oct 21, 1986·16 cites·31 claims
- 2956US12500088B2Tools for chemical planarizationCHEMPOWER CORP·Filed 2022·Granted Dec 16, 2025·0 cites·18 claims
- 3055US2009176371A1Method For The Preferential Polishing Of Silicon Nitride Versus Silicon OxideUNIV CLARKSON·Filed 2008·Application pending·0 cites
- 3155US2025343079A1Determining an endpoint of a planarization processCHEMPOWER CORP·Filed 2025·Application pending·0 cites
- 3253US4735820ARemoval of residual catalyst from a dielectric substrateIBM·Filed 1987·Granted Apr 5, 1988·10 cites·12 claims
- 3353US2009224200A1Polishing slurries for chemical-mechanical polishingCLIMAX ENGINEERED MAT LLC·Filed 2009·Application pending·0 cites
- 3451US2008116171A1Method For The Preferential Polishing Of Silicon Nitride Versus Silicon OxideUNIV CLARKSON·Filed 2006·Application pending·0 cites
- 3550US5840427AMethod for making corrosion resistant electrical componentsTELEDYNE IND·Filed 1996·Granted Nov 24, 1998·15 cites·20 claims
- 3643US7629258B2Method for one-to-one polishing of silicon nitride and silicon oxideUNIV CLARKSON·Filed 2006·Granted Dec 8, 2009·0 cites·5 claims
- 3738US2003047710A1Chemical-mechanical polishingNYACOL NANO TECHNOLOGIES INC·Filed 2001·Application pending·0 cites
- 3838US2003092271A1Shallow trench isolation polishing using mixed abrasive slurriesNYACOL NANO TECHNOLOGIES INC·Filed 2002·Application pending·0 cites
- 3938US2012190200A1Abrasive Free Silicon Chemical Mechanical PlanarizationPENTA NARESH K·Filed 2012·Application pending·0 cites
- 4037US5021138ASide source center sink plasma reactorBABU SURYADEVARA V·Filed 1989·Granted Jun 4, 1991·8 cites·9 claims
- 4134US2003211747A1Shallow trench isolation polishing using mixed abrasive slurriesNYACOL NANO TECHNOLOGIES INC·Filed 2003·Application pending·0 cites
- 4233US5053104AMethod of plasma etching a substrate with a gaseous organohalide compoundIBM·Filed 1989·Granted Oct 1, 1991·6 cites·19 claims
- 4333US2003094593A1Silica and a silica-based slurryFiled 2001·Application pending·0 cites
- 4431US2004127045A1Chemical mechanical planarization of wafers or films using fixed polishing pads and a nanoparticle compositionFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →