Inventor · disambiguated record
Robert N. Jarrett
Also filed as: JARRETT ROBERT · JARRETT ROBERT N · JARRETT ROBERT NORMAN
6 granted patents·46 citations·filing 2006–2019
80Inventor score
Top patents by PatentIndex Score
6 records- 0185US10943796B2Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2019·Granted Mar 9, 2021·4 cites·16 claims
- 0285US7593228B2Technique for forming a thermally conductive interface with patterned metal foilINDIUM CORP AMERICA·Filed 2006·Granted Sep 22, 2009·29 cites·20 claims
- 0384US9468136B2Low void solder joint for multiple reflow applicationsINDIUM CORP·Filed 2014·Granted Oct 11, 2016·9 cites·37 claims
- 0477US10943795B2Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2019·Granted Mar 9, 2021·2 cites·8 claims
- 0577US10607857B2Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2017·Granted Mar 31, 2020·2 cites·10 claims
- 0641US10838002B2Burn-in preform and method of making the sameINDIUM CORP·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →