Inventor · disambiguated record
Chen-Der Huang
Also filed as: HUANG CHEN-DER
2 granted patents·1 pending application·30 citations·filing 1998–2005
61Inventor score
Top patents by PatentIndex Score
3 records- 0178US7105920B2Substrate design to improve chip package reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 12, 2006·23 cites·18 claims
- 0237US2006170114A1Novel method for copper wafer wire bondingSU CHAO-YUAN·Filed 2005·Application pending·0 cites
- 0332US6323541B1Structure for manufacturing a semiconductor die with copper plated tapesVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Nov 27, 2001·7 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Chen-Der Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →