Inventor · disambiguated record
Emmanuel Arene
Also filed as: ARENE EMMANUEL · ARÈNE EMMANUEL
10 granted patents·2 pending applications·107 citations·filing 2004–2021
89Inventor score
Top patents by PatentIndex Score
12 records- 0193US7018909B2Forming structures that include a relaxed or pseudo-relaxed layer on a substrateSOITEC SILICON ON INSULATOR·Filed 2004·Granted Mar 28, 2006·51 cites·31 claims
- 0287US7736988B2Forming structures that include a relaxed or pseudo-relaxed layer on a substrateSOITEC SILICON ON INSULATOR·Filed 2006·Granted Jun 15, 2010·9 cites·10 claims
- 0382US7138325B2Method of manufacturing a waferSOITEC SILICON ON INSULATOR·Filed 2004·Granted Nov 21, 2006·28 cites·22 claims
- 0479US11822309B2System for inserting a wire into a semiconductor chipPRIMO1D·Filed 2021·Granted Nov 21, 2023·1 cites·19 claims
- 0579US11081466B2Method for joining a micorelectronic chip to a wire elementPRIMO1D·Filed 2018·Granted Aug 3, 2021·4 cites·20 claims
- 0675US11209799B2Method for inserting a wire into a groove of a semiconductor chipPRIMO1D·Filed 2018·Granted Dec 28, 2021·3 cites·11 claims
- 0775US8173512B2Forming structures that include a relaxed or pseudo-relaxed layer on a substrateGHYSELEN BRUNO·Filed 2011·Granted May 8, 2012·3 cites·8 claims
- 0874US7919393B2Forming structures that include a relaxed or pseudo-relaxed layer on a substrateSOITEC SILICON ON INSULATOR·Filed 2010·Granted Apr 5, 2011·2 cites·20 claims
- 0969US11502411B2Radiofrequency transmission/reception devicePRIMO1D·Filed 2018·Granted Nov 15, 2022·2 cites·16 claims
- 1067US7883628B2Method of reducing the surface roughness of a semiconductor waferSOITEC SILICON ON INSULATOR·Filed 2005·Granted Feb 8, 2011·4 cites·23 claims
- 1139US2004192067A1Method for forming a relaxed or pseudo-relaxed useful layer on a substrateFiled 2004·Application pending·0 cites
- 1233US2019371716A1Method for fabricating an integrated circuit chip and integrated circuit chipCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →