Inventor · disambiguated record
Shoko Omizo
Also filed as: OMIZO SHOKO
10 granted patents·1 pending application·161 citations·filing 1998–2013
89Inventor score
Top patents by PatentIndex Score
11 records- 0186US6400037B1Method of marking on metallic layer, metallic layer with marks thereon and semiconductor device having the metallic layerTOSHIBA KK·Filed 2000·Granted Jun 4, 2002·42 cites·3 claims
- 0284US7276784B2Semiconductor device and a method of assembling a semiconductor deviceTOSHIBA KK·Filed 2005·Granted Oct 2, 2007·12 cites·10 claims
- 0377US8659137B2Stacked semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2013·Granted Feb 25, 2014·4 cites·7 claims
- 0475US8557635B2Stacked semiconductor device and manufacturing method thereofOMIZO SHOKO·Filed 2012·Granted Oct 15, 2013·5 cites·16 claims
- 0574US8796076B2Stacked semiconductor devices and fabrication method/equipment for the sameYOSHIMURA ATSUSHI·Filed 2012·Granted Aug 5, 2014·4 cites·15 claims
- 0673US6261919B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1999·Granted Jul 17, 2001·45 cites·8 claims
- 0771US6686222B2Stacked semiconductor device manufacturing methodTOSHIBA KK·Filed 2002·Granted Feb 3, 2004·16 cites·26 claims
- 0868US6143587AMethod of marking on semiconductor device having metallic layerTOSHIBA KK·Filed 1998·Granted Nov 7, 2000·31 cites·4 claims
- 0962US7955896B2Method of manufacturing stacked semiconductor deviceTOSHIBA KK·Filed 2009·Granted Jun 7, 2011·2 cites·20 claims
- 1047US2007292989A1Semiconductor device and a method of assembling a semiconductor deviceTOSHIBA KK·Filed 2007·Application pending·0 cites
- 1145US7849897B2Apparatus and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Dec 14, 2010·0 cites·10 claims
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