Inventor · disambiguated record

Toshimasa Kitagawa

Also filed as: KITAGAWA TOSHIMASA

1 granted patent·26 citations·filing 1993–1993

43Inventor score

Technology areasH10W

Files withMATSUSHITA ELECTRIC WORKS LTD1

Top patents by PatentIndex Score

1 record

0154US5403785AProcess of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated therebyMATSUSHITA ELECTRIC WORKS LTD·Filed 1993·Granted Apr 4, 1995·26 cites·18 claims

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