Inventor · disambiguated record
Hisanobu Ohkawa
Also filed as: OHKAWA HISANOBU
3 granted patents·10 citations·filing 2009–2011
58Inventor score
Top patents by PatentIndex Score
3 records- 0173US8207586B2Substrate bonded MEMS sensorSATO KIYOSHI·Filed 2009·Granted Jun 26, 2012·9 cites·4 claims
- 0259US8418557B2Physical quantity sensorYAZAWA HISAYUKI·Filed 2010·Granted Apr 16, 2013·1 cites·7 claims
- 0334US8459116B2Physical quantity sensorMIYATAKE AKIRA·Filed 2011·Granted Jun 11, 2013·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →