Inventor · disambiguated record
Shyue-Ter Leu
Also filed as: LEU SHYUE-TER
27 granted patents·6 pending applications·72 citations·filing 2015–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD33
Top patents by PatentIndex Score
33 records- 0196US9653391B1Semiconductor packaging structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·23 cites·20 claims
- 0295US11251114B2Package substrate insulation opening designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0394US9870975B1Chip package with thermal dissipation structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·12 cites·20 claims
- 0493US11854956B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0593US11817382B2Package substrate insulation opening designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0693US9881908B2Integrated fan-out package on package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·11 cites·18 claims
- 0791US9721868B2Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·9 cites·20 claims
- 0890US11328971B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 0986US2025300036A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1085US12354928B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 1185US12300632B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1284US9748156B1Semiconductor package assembly, semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
- 1382US11996346B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1482US10109547B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 23, 2018·3 cites·20 claims
- 1581US12412827B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1681US2025309089A1Semiconductor die package with conductive line crack prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1779US12347817B2Semiconductor device package having warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 1879US11855009B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1978US12368092B2Package substrate insulation opening designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 2078US12261125B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 2178US2024379640A1Method of forming a semiconductor device package with warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2275US2025316499A1Packaging substrate and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2375US2025210536A1Chip package structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2474US11699631B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2573US11410939B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 2670US11804445B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 2769US11978729B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 2868US12354884B2Method for making a packaging substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 2963US12230593B2Wafer level package with polymer layer delamination prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 3062US2025157955A1Wafer level package with polymer layer delamination prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3161US10797006B2Structure and formation method of chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·20 claims
- 3258US10727147B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 3356US10163816B2Structure and formation method of chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →