Inventor · disambiguated record
Haiying Mei
Also filed as: MEI HAIYING
7 granted patents·5 pending applications·25 citations·filing 2016–2019
81Inventor score
Files withIBIDEN CO LTD12
Top patents by PatentIndex Score
12 records- 0189US10256175B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2017·Granted Apr 9, 2019·6 cites·20 claims
- 0287US10004143B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2016·Granted Jun 19, 2018·6 cites·15 claims
- 0384US10674604B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Jun 2, 2020·4 cites·20 claims
- 0482US10249561B2Printed wiring board having embedded pads and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Apr 2, 2019·4 cites·20 claims
- 0579US10271430B2Printed wiring board having support plate and method for manufacturing printed wiring board having support plateIBIDEN CO LTD·Filed 2017·Granted Apr 23, 2019·3 cites·14 claims
- 0673US9949372B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Apr 17, 2018·2 cites·16 claims
- 0755US10874018B2Printed wiring board having embedded pads and method for manufacturing the sameIBIDEN CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 0852US2019139877A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2018·Application pending·0 cites
- 0948US2018054888A1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 1037US2018054891A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 1137US2017263571A1Electronic component built-in substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 1236US2017064825A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →