Inventor · disambiguated record
Daryl Sato
Also filed as: SATO DARYL · SATO DARYL A
21 granted patents·4 pending applications·476 citations·filing 2001–2009
96Inventor score
Top patents by PatentIndex Score
25 records- 0197US6787443B1PCB design and method for providing vented blind viasINTEL CORP·Filed 2003·Granted Sep 7, 2004·139 cites·6 claims
- 0295US6747216B2Power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryINTEL CORP·Filed 2002·Granted Jun 8, 2004·52 cites·10 claims
- 0392US6580174B2Vented vias for via in pad technology yield improvementsINTEL CORP·Filed 2001·Granted Jun 17, 2003·84 cites·13 claims
- 0483US7583513B2Apparatus for providing an integrated printed circuit board registration couponINTEL CORP·Filed 2003·Granted Sep 1, 2009·31 cites·11 claims
- 0583US6941537B2Standoff devices and methods of using sameINTEL CORP·Filed 2002·Granted Sep 6, 2005·31 cites·63 claims
- 0680US7061095B2Printed circuit board conductor channelingINTEL CORP·Filed 2001·Granted Jun 13, 2006·27 cites·17 claims
- 0778US7325303B2Three-dimensional flexible interposerINTEL CORP·Filed 2006·Granted Feb 5, 2008·15 cites·19 claims
- 0875US6642158B1Photo-thermal induced diffusionINTEL CORP·Filed 2002·Granted Nov 4, 2003·13 cites·10 claims
- 0973US7385288B2Electronic packaging using conductive interproser connectorINTEL CORP·Filed 2007·Granted Jun 10, 2008·5 cites·8 claims
- 1073US7269899B2Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryINTEL CORP·Filed 2003·Granted Sep 18, 2007·11 cites·8 claims
- 1169US7084354B2PCB method and apparatus for producing landless interconnectsINTEL CORP·Filed 2002·Granted Aug 1, 2006·14 cites·26 claims
- 1268US7145243B2Photo-thermal induced diffusionINTEL CORP·Filed 2003·Granted Dec 5, 2006·9 cites·6 claims
- 1368US7064063B2Photo-thermal induced diffusionINTEL CORP·Filed 2003·Granted Jun 20, 2006·9 cites·19 claims
- 1467US7201583B2Three-dimensional flexible interposerINTEL CORP·Filed 2003·Granted Apr 10, 2007·14 cites·19 claims
- 1560US7797826B2Method of power-ground plane partitioning to utilize channel/trenchesINTEL CORP·Filed 2007·Granted Sep 21, 2010·1 cites·6 claims
- 1658US6667090B2Coupon registration mechanism and methodINTEL CORP·Filed 2001·Granted Dec 23, 2003·7 cites·26 claims
- 1755US8299369B2Power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryBRIST GARY A·Filed 2009·Granted Oct 30, 2012·0 cites·11 claims
- 1855US7061116B2Arrangement of vias in a substrate to support a ball grid arrayINTEL CORP·Filed 2001·Granted Jun 13, 2006·6 cites·3 claims
- 1951US7241680B2Electronic packaging using conductive interposer connectorINTEL CORP·Filed 2004·Granted Jul 10, 2007·4 cites·7 claims
- 2049US7147141B2Preconditioning via plug material for a via-in-pad ball grid array packageINTEL CORP·Filed 2002·Granted Dec 12, 2006·4 cites·17 claims
- 2146US8056221B2Power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryBRIST GARY A·Filed 2007·Granted Nov 15, 2011·0 cites·6 claims
- 2243US2004231886A1PCB design and method for providing vented blind viasFiled 2004·Application pending·0 cites
- 2339US2004219342A1Electronic substrate with direct inner layer component interconnectionFiled 2003·Application pending·0 cites
- 2436US2004129453A1Electronic substrate with direct inner layer component interconnectionFiled 2003·Application pending·0 cites
- 2529US2003047348A1Grid array mounting arrangementsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →