Inventor · disambiguated record
Georg Pietsch
Also filed as: PIETSCH GEORG · PIETSCH GEORG J
24 granted patents·4 pending applications·137 citations·filing 1997–2021
94Inventor score
Files withSILTRONIC AG13PIETSCH GEORG9SCHWANDNER JUERGEN2WACKER SILTRONIC HALBLEITERMAT2KERSTAN MICHAEL1
Top patents by PatentIndex Score
28 records- 0189US8113913B2Method for the simultaneous grinding of a plurality of semiconductor wafersPIETSCH GEORG·Filed 2008·Granted Feb 14, 2012·22 cites·29 claims
- 0288US7867059B2Semiconductor wafer, apparatus and process for producing the semiconductor waferSILTRONIC AG·Filed 2007·Granted Jan 11, 2011·21 cites·16 claims
- 0386US9199791B2Device and method for buffer-storing a multiplicity of wafer-type workpiecesPIETSCH GEORG·Filed 2012·Granted Dec 1, 2015·9 cites·12 claims
- 0483US9333673B2Method for simultaneously cutting a multiplicity of wafers from a workpieceSILTRONIC AG·Filed 2014·Granted May 10, 2016·5 cites·14 claims
- 0583US7815489B2Method for the simultaneous double-side grinding of a plurality of semiconductor wafersSILTRONIC AG·Filed 2007·Granted Oct 19, 2010·15 cites·24 claims
- 0677US8647985B2Method for polishing a substrate composed of semiconductor materialSCHWANDNER JUERGEN·Filed 2008·Granted Feb 11, 2014·6 cites·13 claims
- 0774US9011209B2Method and apparatus for trimming the working layers of a double-side grinding apparatusSILTRONIC AG·Filed 2014·Granted Apr 21, 2015·2 cites·2 claims
- 0874US7077726B2Semiconductor wafer with improved local flatness, and method for its productionSILTRONIC AG·Filed 2002·Granted Jul 18, 2006·16 cites·3 claims
- 0972US8801500B2Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafersPIETSCH GEORG·Filed 2011·Granted Aug 12, 2014·3 cites·9 claims
- 1064US9539695B2Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafersPIETSCH GEORG·Filed 2008·Granted Jan 10, 2017·3 cites·26 claims
- 1164US8911281B2Method for trimming the working layers of a double-side grinding apparatusPIETSCH GEORG·Filed 2011·Granted Dec 16, 2014·1 cites·5 claims
- 1262US8974267B2Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafersPIETSCH GEORG·Filed 2011·Granted Mar 10, 2015·1 cites·13 claims
- 1357US11878359B2Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingotSILTRONIC AG·Filed 2018·Granted Jan 23, 2024·0 cites·11 claims
- 1457US8986070B2Method for trimming the working layers of a double-side grinding apparatusSILTRONIC AG·Filed 2014·Granted Mar 24, 2015·0 cites·4 claims
- 1555US12311577B2Method and apparatus for simultaneously slicing a multiplicity of slices from a workpieceSILTRONIC AG·Filed 2021·Granted May 27, 2025·0 cites·11 claims
- 1653US8512099B2Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafersKERSTAN MICHAEL·Filed 2009·Granted Aug 20, 2013·2 cites·13 claims
- 1752US6051498AMethod for manufacturing a semiconductor wafer which is coated on one side and provided with a finishWACKER SILTRONIC HALBLEITERMAT·Filed 1998·Granted Apr 18, 2000·20 cites·8 claims
- 1848US8851958B2Method for the simultaneous double-side material-removing processing of at least three workpiecesPIETSCH GEORG·Filed 2012·Granted Oct 7, 2014·0 cites·11 claims
- 1947US2022234250A1Method for separating a plurality of slices from workpieces during a number of separating processes by means of a wire saw, and semiconductor wafer made of monocrystalline siliconSILTRONIC AG·Filed 2020·Application pending·0 cites
- 2046US9573296B2Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpieceSILTRONIC AG·Filed 2015·Granted Feb 21, 2017·0 cites·29 claims
- 2146US2008265375A1Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx LayerSILTRONIC AG·Filed 2008·Application pending·0 cites
- 2243US5952242AMethod and device for removing a semiconductor wafer from a flat substrateWACKER SILTRONIC HALBLEITERMAT·Filed 1997·Granted Sep 14, 1999·11 cites·9 claims
- 2342US9346188B2Apparatus and method for simultaneously slicing a multiplicity of slices from a workpieceSILTRONIC AG·Filed 2013·Granted May 24, 2016·0 cites·13 claims
- 2440US2005173377A1Semiconductor wafer, apparatus and process for producing the semiconductor waferFiled 2005·Application pending·0 cites
- 2539US8795776B2Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatusPIETSCH GEORG·Filed 2012·Granted Aug 5, 2014·0 cites·13 claims
- 2639US8398878B2Methods for producing and processing semiconductor wafersPIETSCH GEORG·Filed 2010·Granted Mar 19, 2013·0 cites·27 claims
- 2736US8685270B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Apr 1, 2014·0 cites·10 claims
- 2832US2011133314A1Method for producing a semiconductor waferSILTRONIC AG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →