Inventor · disambiguated record
Keiji Maeda
Also filed as: MAEDA KEIJI
18 granted patents·14 pending applications·205 citations·filing 1996–2024
94Inventor score
Top patents by PatentIndex Score
32 records- 0191US7760662B2Data transfer system and methodJUNIPER NETWORKS INC·Filed 2008·Granted Jul 20, 2010·17 cites·20 claims
- 0287US7486690B2Data transfer system and method of transferring data packets using aggregation/disaggregationJUNIPER NETWORKS INC·Filed 2005·Granted Feb 3, 2009·12 cites·21 claims
- 0384US6904049B1Data transfer system and method for transferring data packets over an ATM linkJUNIPER NETWORKS INC·Filed 2000·Granted Jun 7, 2005·31 cites·40 claims
- 0478US6773247B1Die used for resin-sealing and molding an electronic componentTOWA CORP·Filed 2000·Granted Aug 10, 2004·31 cites·11 claims
- 0576US6346433B1Method of coating semiconductor wafer with resin and mold used thereforTOWA CORP·Filed 2000·Granted Feb 12, 2002·27 cites·17 claims
- 0675US7901797B2Low-adhesion material, resin molding die, and soil resistant materialTOWA CORP·Filed 2006·Granted Mar 8, 2011·2 cites·15 claims
- 0771US7614293B2Method of evaluating adhesion property, low-adhesion material, and mold for molding resinTOWA CORP·Filed 2005·Granted Nov 10, 2009·2 cites·1 claims
- 0870US7732037B2Conductive porous material, resin molding die employing the same, and method of preparing conductive porous materialTOWA CORP·Filed 2005·Granted Jun 8, 2010·2 cites·9 claims
- 0969US7784764B2Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing materialTOWA CORP·Filed 2005·Granted Aug 31, 2010·2 cites·11 claims
- 1067US6368707B1Heat-sensitive adhesive sheetTOAGOSEI CO LTD·Filed 1997·Granted Apr 9, 2002·33 cites·8 claims
- 1166US7399574B2Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panelDAINIPPON PRINTING CO LTD·Filed 2002·Granted Jul 15, 2008·10 cites·22 claims
- 1263US7287975B2Resin mold material and resin moldJAPAN FINE CERAMICS CT·Filed 2004·Granted Oct 30, 2007·5 cites·15 claims
- 1360US2010012816A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2009·Application pending·0 cites
- 1459US5783220AResin sealing and molding apparatus for sealing electronic partsTOWA CORP·Filed 1996·Granted Jul 21, 1998·19 cites·15 claims
- 1556US7407146B2Composite material and resin moldTOWA CORP·Filed 2004·Granted Aug 5, 2008·3 cites·8 claims
- 1654US2012076886A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2011·Application pending·0 cites
- 1752US2005176405A1Train network access service management method and communication system employing this method, and service management system thereforNEC CORP·Filed 2005·Application pending·0 cites
- 1852US2011042857A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2010·Application pending·0 cites
- 1952US2025016294A1Maintenance methodPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 2050US7957416B2Data transfer system and methodJUNIPER NETWORKS INC·Filed 2010·Granted Jun 7, 2011·0 cites·20 claims
- 2149US7084186B2Crosslinkable resin compositionsTOAGOSEI CO LTD·Filed 2001·Granted Aug 1, 2006·2 cites·24 claims
- 2248US2016065000A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2346US8611372B2Data transfer system and methodMAEDA KEIJI·Filed 2011·Granted Dec 17, 2013·0 cites·20 claims
- 2446US2011233821A1Compression resin sealing and molding method for electronic component and apparatus thereforTOWA CORP·Filed 2009·Application pending·0 cites
- 2543US2007072346A1Method of resin-seal-molding electronic component and apparatus thereforTOWA CORP·Filed 2006·Application pending·0 cites
- 2642US2007069421A1Method of resin-seal-molding electronic component and apparatus thereforTOWA CORP·Filed 2006·Application pending·0 cites
- 2742US2008296532A1Low Adhesion Material, Resin Molding Die, and Soil Resistant MaterialKUNO TAKAKI·Filed 2006·Application pending·0 cites
- 2841US2001052025A1Router setting method and router setting apparatusNEC CORP·Filed 2001·Application pending·0 cites
- 2941US2006189710A1Aqueous inkHAYASHI KATSUHIRO·Filed 2004·Application pending·0 cites
- 3040US2006131780A1Resin casting mold and method of casting resinTOWA CORP·Filed 2005·Application pending·0 cites
- 3137US5750154AResin sealing/molding apparatus for electronic partsTOWA CORP·Filed 1996·Granted May 12, 1998·7 cites·8 claims
- 3237US2010153625A1Semiconductor memory deviceTOSHIBA KK·Filed 2008·Application pending·0 cites
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