Inventor · disambiguated record
Chris Haga
Also filed as: HAGA CHRIS · HAGA CHRIS E · HAGA CHRIS EDWARD
4 granted patents·4 pending applications·15 citations·filing 2004–2009
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0175US7498203B2Thermally enhanced BGA package with ground ringTEXAS INSTRUMENTS INC·Filed 2006·Granted Mar 3, 2009·8 cites·9 claims
- 0258US8053285B2Thermally enhanced single inline package (SIP)TEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·1 cites·13 claims
- 0358US7612437B2Thermally enhanced single inline package (SIP)TEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 3, 2009·1 cites·12 claims
- 0454US7084494B2Semiconductor package having integrated metal parts for thermal enhancementTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 1, 2006·5 cites·16 claims
- 0546US2006226521A1Semiconductor Package Having Integrated Metal Parts for Thermal EnhancementCOYLE ANTHONY L·Filed 2006·Application pending·0 cites
- 0641US2008079124A1Interdigitated leadfingersHAGA CHRIS EDWARD·Filed 2007·Application pending·0 cites
- 0738US2007090533A1Closed loop thermally enhanced flip chip BGATEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 0837US2005151268A1Wafer-level assembly method for chip-size devices having flipped chipsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →