Inventor · disambiguated record
Po-Chun Lin
Also filed as: LIN PO CHUN
69 granted patents·30 pending applications·144 citations·filing 2012–2025
98Inventor score
Top patents by PatentIndex Score
99 records- 0195US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 0294US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0393US12002768B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 0493US11374136B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0593US9935071B1Semiconductor package with lateral bump structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Apr 3, 2018·9 cites·10 claims
- 0693US9831155B2Chip package having tilted through silicon viaNANYA TECHNOLOGY CORP·Filed 2016·Granted Nov 28, 2017·10 cites·18 claims
- 0793US9812414B1Chip package and a manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2016·Granted Nov 7, 2017·10 cites·16 claims
- 0892US9786593B1Semiconductor device and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2016·Granted Oct 10, 2017·9 cites·15 claims
- 0991US11159457B2Chatbot orchestrationIBM·Filed 2019·Granted Oct 26, 2021·14 cites·17 claims
- 1090US9305902B1Chip package and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2015·Granted Apr 5, 2016·6 cites·10 claims
- 1189US10141275B2Method for manufacturing a semiconductor structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Nov 27, 2018·5 cites·6 claims
- 1288US10103114B2Semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2016·Granted Oct 16, 2018·5 cites·11 claims
- 1388US9893037B1Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereofNANYA TECHNOLOGY CORP·Filed 2017·Granted Feb 13, 2018·6 cites·20 claims
- 1486US12362274B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1585US10068865B1Combing bump structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2017·Granted Sep 4, 2018·4 cites·3 claims
- 1685US10037937B2Method for forming semiconductor packageNANYA TECHNOLOGY CORP·Filed 2018·Granted Jul 31, 2018·3 cites·10 claims
- 1785US2025273565A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1884US9922920B1Semiconductor package and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2016·Granted Mar 20, 2018·3 cites·10 claims
- 1984US9799624B1Wire bonding method and wire bonding structureNANYA TECHNOLOGY CORP·Filed 2016·Granted Oct 24, 2017·4 cites·8 claims
- 2084US9704818B1Semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2016·Granted Jul 11, 2017·4 cites·17 claims
- 2183US12381163B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 2283US12334434B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2382US10438887B2Semiconductor chip and multi-chip package using thereof and method for manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted Oct 8, 2019·3 cites·9 claims
- 2481US2025316616A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2580US9991215B1Semiconductor structure with through substrate via and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2017·Granted Jun 5, 2018·3 cites·19 claims
- 2678US10431559B2Method for manufacturing a semiconductor structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Oct 1, 2019·2 cites·7 claims
- 2777US10825794B2Method for preparing a semiconductor apparatusNANYA TECHNOLOGY CORP·Filed 2018·Granted Nov 3, 2020·1 cites·4 claims
- 2877US10256179B2Package structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2017·Granted Apr 9, 2019·2 cites·11 claims
- 2977US9508673B2Wire bonding methodNANYA TECHNOLOGY CORP·Filed 2016·Granted Nov 29, 2016·2 cites·10 claims
- 3076US10170432B2Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Jan 1, 2019·2 cites·15 claims
- 3176US9536785B2Method of manufacturing through silicon via stacked structureNANYA TECHNOLOGY CORP·Filed 2015·Granted Jan 3, 2017·2 cites·5 claims
- 3276US2024088307A1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3375US9881867B1Conductive connection structure having stress buffer layerNANYA TECHNOLOGY CORP·Filed 2017·Granted Jan 30, 2018·2 cites·16 claims
- 3474US11855232B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·13 claims
- 3574US10580665B2Method for manufacturing package structure having elastic bumpNANYA TECHNOLOGY CORP·Filed 2018·Granted Mar 3, 2020·1 cites·10 claims
- 3674US9960146B1Semiconductor structure and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted May 1, 2018·2 cites·20 claims
- 3774US9147642B2Integrated circuit deviceNANYA TECHNOLOGY CORP·Filed 2013·Granted Sep 29, 2015·3 cites·14 claims
- 3870US9240381B2Chip package and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2013·Granted Jan 19, 2016·2 cites·10 claims
- 3969US10192841B2Semiconductor package and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted Jan 29, 2019·1 cites·9 claims
- 4068US10170339B2Semiconductor structure and a manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2016·Granted Jan 1, 2019·1 cites·14 claims
- 4168US9966363B1Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted May 8, 2018·1 cites·18 claims
- 4268US9252105B2Chip packageNANYA TECHNOLOGY CORP·Filed 2014·Granted Feb 2, 2016·2 cites·20 claims
- 4367US10050021B1Die device, semiconductor device and method for making the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted Aug 14, 2018·1 cites·15 claims
- 4467US9711442B1Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2016·Granted Jul 18, 2017·1 cites·20 claims
- 4566US9761535B1Interposer, semiconductor package with the same and method for preparing a semiconductor package with the sameNANYA TECHNOLOGY CORP·Filed 2016·Granted Sep 12, 2017·1 cites·20 claims
- 4663US10923455B2Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2018·Granted Feb 16, 2021·0 cites·4 claims
- 4761US10552862B2Interruption point determinationIBM·Filed 2017·Granted Feb 4, 2020·0 cites·16 claims
- 4860US11151597B2Interruption point determinationIBM·Filed 2020·Granted Oct 19, 2021·0 cites·16 claims
- 4960US10361171B2Stacked package structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2018·Granted Jul 23, 2019·0 cites·7 claims
- 5058US10535621B2Method for preparing a semiconductor packageNANYA TECHNOLOGY CORP·Filed 2018·Granted Jan 14, 2020·0 cites·9 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →