Assignee
LIN PO-CHUN
TW·1 granted patent·2 pending applications·0 citations·filing 2012–2012
Top patents by PatentIndex Score
3 records- 0144US9281242B2Through silicon via stacked structure and a method of manufacturing the sameLIN PO-CHUN·Filed 2012·Granted Mar 8, 2016·0 cites·7 claims
- 0239US2014118978A1Package substrate and chip package using the sameLIN PO-CHUN·Filed 2012·Application pending·0 cites
- 0335US2013341807A1Semiconductor package structureLIN PO-CHUN·Filed 2012·Application pending·0 cites
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