Inventor · disambiguated record
Shannon D. Buzard
Also filed as: BUZARD SHANNON D
1 granted patent·1 pending application·1 citations·filing 2013–2014
17Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0156US8980743B2Method for applying a final metal layer for wafer level packaging and associated deviceFLIPCHIP INT LLC·Filed 2013·Granted Mar 17, 2015·1 cites·14 claims
- 0238US2015270223A1Method for applying a final metal layer for wafer level packaging and associated deviceBURGESS GUY F·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →