Inventor · disambiguated record
Kishor Desai
Also filed as: DESAI KISHOR V · DESAI KISHOR VITHALDAS · DESAI Kishor
79 granted patents·2 pending applications·2,239 citations·filing 1984–2019
99Inventor score
Top patents by PatentIndex Score
81 records- 0198US8378478B2Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contactsTESSERA INC·Filed 2010·Granted Feb 19, 2013·48 cites·26 claims
- 0297US9349669B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2015·Granted May 24, 2016·23 cites·25 claims
- 0397US9000600B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2014·Granted Apr 7, 2015·28 cites·15 claims
- 0497US8697492B2No flow underfillHABA BELGACEM·Filed 2010·Granted Apr 15, 2014·36 cites·19 claims
- 0597US6335491B1Interposer for semiconductor package assemblyLSI LOGIC CORP·Filed 2000·Granted Jan 1, 2002·129 cites·18 claims
- 0696US5137456AHigh density, separable connector and contact for use thereinIBM·Filed 1991·Granted Aug 11, 1992·156 cites·15 claims
- 0795US6002172ASubstrate structure and method for improving attachment reliability of semiconductor chips and modulesIBM·Filed 1997·Granted Dec 14, 1999·98 cites·6 claims
- 0894US9817197B2Optically aligned hybrid semiconductor device and methodCORIANT ADVANCED TECH LLC·Filed 2016·Granted Nov 14, 2017·10 cites·10 claims
- 0994US6552266B2High performance chip packaging and methodIBM·Filed 2001·Granted Apr 22, 2003·96 cites·12 claims
- 1094US5199879AElectrical assembly with flexible circuitIBM·Filed 1992·Granted Apr 6, 1993·156 cites·20 claims
- 1193US8803269B2Wafer scale packaging platform for transceiversSHASTRI KALPENDU·Filed 2012·Granted Aug 12, 2014·21 cites·18 claims
- 1293US8780576B2Low CTE interposerHABA BELGACEM·Filed 2011·Granted Jul 15, 2014·12 cites·29 claims
- 1393US6281581B1Substrate structure for improving attachment reliability of semiconductor chips and modulesIBM·Filed 1999·Granted Aug 28, 2001·70 cites·8 claims
- 1493US5159535AMethod and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrateIBM·Filed 1989·Granted Oct 27, 1992·145 cites·12 claims
- 1592US8905632B2Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic componentsCISCO TECH INC·Filed 2012·Granted Dec 9, 2014·11 cites·20 claims
- 1692US6224396B1Compliant, surface-mountable interposerIBM·Filed 1999·Granted May 1, 2001·91 cites·29 claims
- 1791US10678005B2Optically aligned hybrid semiconductor device and methodELENION TECH LLC·Filed 2019·Granted Jun 9, 2020·6 cites·19 claims
- 1891US6166434ADie clip assembly for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Dec 26, 2000·128 cites·13 claims
- 1990US8378485B2Solder interconnect by addition of copperLSI CORP·Filed 2009·Granted Feb 19, 2013·16 cites·23 claims
- 2088US8723049B2Low-stress TSV design using conductive particlesWOYCHIK CHARLES G·Filed 2011·Granted May 13, 2014·9 cites·23 claims
- 2186US9031107B2Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic componentsCISCO TECH INC·Filed 2014·Granted May 12, 2015·5 cites·20 claims
- 2286US7119432B2Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor packageLSI LOGIC CORP·Filed 2004·Granted Oct 10, 2006·42 cites·15 claims
- 2386US6618938B1Interposer for semiconductor package assemblyLSI LOGIC CORP·Filed 2001·Granted Sep 16, 2003·31 cites·18 claims
- 2486US4788767AMethod for mounting a flexible film semiconductor chip carrier on a circuitized substrateIBM·Filed 1987·Granted Dec 6, 1988·77 cites·10 claims
- 2585US9508687B2Low cost hybrid high density packageTESSERA INC·Filed 2015·Granted Nov 29, 2016·4 cites·16 claims
- 2685US9213152B2Releasable fiber connector for opto-electronic assembliesCISCO TECH INC·Filed 2013·Granted Dec 15, 2015·7 cites·17 claims
- 2785US8772946B2Reduced stress TSV and interposer structuresUZOH CYPRIAN EMEKA·Filed 2012·Granted Jul 8, 2014·6 cites·83 claims
- 2885US5880590AApparatus and method for burn-in and testing of devices with solder bumps or preformsIBM·Filed 1997·Granted Mar 9, 1999·93 cites·13 claims
- 2985US5435480AMethod for filling plated through holesIBM·Filed 1993·Granted Jul 25, 1995·67 cites·12 claims
- 3084US10222565B2Optically aligned hybrid semiconductor device and methodELENION TECH LLC·Filed 2017·Granted Mar 5, 2019·3 cites·18 claims
- 3184US9235019B2Self-aligning optical connector assemblyCISCO TECH INC·Filed 2014·Granted Jan 12, 2016·6 cites·9 claims
- 3283US9274290B2Coupling light from a waveguide array to single mode fiber arrayCISCO TECH INC·Filed 2012·Granted Mar 1, 2016·5 cites·11 claims
- 3383US6133064AFlip chip ball grid array package with laminated substrateLSI LOGIC CORP·Filed 1999·Granted Oct 17, 2000·72 cites·6 claims
- 3482US6431432B1Method for attaching solderballs by selectively oxidizing tracesLSI LOGIC CORP·Filed 2000·Granted Aug 13, 2002·29 cites·3 claims
- 3582US5201451AMethod and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrateIBM·Filed 1991·Granted Apr 13, 1993·82 cites·7 claims
- 3678US8963310B2Low cost hybrid high density packageDESAI Kishor·Filed 2011·Granted Feb 24, 2015·5 cites·16 claims
- 3777US6518161B1Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded dieLSI LOGIC CORP·Filed 2001·Granted Feb 11, 2003·26 cites·21 claims
- 3876US9433100B2Low-stress TSV design using conductive particlesTESSERA INC·Filed 2014·Granted Aug 30, 2016·3 cites·23 claims
- 3975US6586825B1Dual chip in package with a wire bonded die mounted to a substrateLSI LOGIC CORP·Filed 2001·Granted Jul 1, 2003·23 cites·37 claims
- 4073US9417412B2Arrangement for placement and alignment of opto-electronic componentsCISCO TECH INC·Filed 2014·Granted Aug 16, 2016·2 cites·24 claims
- 4173US9401288B2Low CTE interposerINVENSAS CORP·Filed 2014·Granted Jul 26, 2016·2 cites·19 claims
- 4273US8876410B2Self-aligning connectorized fiber array assemblyCISCO TECH INC·Filed 2013·Granted Nov 4, 2014·3 cites·20 claims
- 4373US5170931AMethod and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrateIBM·Filed 1991·Granted Dec 15, 1992·52 cites·10 claims
- 4472US8830466B2Arrangement for placement and alignment of opto-electronic componentsCISCO TECH INC·Filed 2012·Granted Sep 9, 2014·2 cites·20 claims
- 4572US8580621B2Solder interconnect by addition of copperLSI CORP·Filed 2013·Granted Nov 12, 2013·2 cites·10 claims
- 4670US9837344B2Low CTE interposerINVENSAS CORP·Filed 2016·Granted Dec 5, 2017·1 cites·20 claims
- 4770US9196581B2Flow underfill for microelectronic packagesTESSERA INC·Filed 2014·Granted Nov 24, 2015·2 cites·20 claims
- 4870US6251766B1Method for improving attachment reliability of semiconductor chips and modulesIBM·Filed 1999·Granted Jun 26, 2001·23 cites·6 claims
- 4970US5479703AMethod of making a printed circuit board or cardIBM·Filed 1994·Granted Jan 2, 1996·46 cites·1 claims
- 5070US5259781AElectrical connector alignment and actuation assemblyIBM·Filed 1992·Granted Nov 9, 1993·34 cites·26 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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