Inventor · disambiguated record
Florence R. Pon
Also filed as: PON FLORENCE · PON FLORENCE R
28 granted patents·8 pending applications·37 citations·filing 2003–2024
93Inventor score
Top patents by PatentIndex Score
36 records- 0194US10032707B2Post-grind die backside power deliveryINTEL CORP·Filed 2016·Granted Jul 24, 2018·12 cites·25 claims
- 0286US11036370B2Computer-assisted or autonomous driving vehicles social networkINTEL CORP·Filed 2018·Granted Jun 15, 2021·8 cites·14 claims
- 0386US9917041B13D chip assemblies using stacked leadframesINTEL CORP·Filed 2016·Granted Mar 13, 2018·6 cites·20 claims
- 0483US11704007B2Computer-assisted or autonomous driving vehicles social networkINTEL CORP·Filed 2021·Granted Jul 18, 2023·1 cites·29 claims
- 0579US10332899B23D package having edge-aligned die stack with direct inter-die wire connectionsINTEL CORP·Filed 2017·Granted Jun 25, 2019·3 cites·11 claims
- 0676US12340077B2Computer-assisted or autonomous driving vehicles social networkINTEL CORP·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 0774US11901264B2Choked flow coolingSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2018·Granted Feb 13, 2024·2 cites·25 claims
- 0873US12266591B2Choked flow coolingSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2024·Granted Apr 1, 2025·0 cites·16 claims
- 0970US11545464B2Diode for use in testing semiconductor packagesINTEL CORP·Filed 2018·Granted Jan 3, 2023·1 cites·18 claims
- 1069US12068283B2Die stack with cascade and vertical connectionsINTEL CORP·Filed 2021·Granted Aug 20, 2024·0 cites·15 claims
- 1167US11399434B2Electronic package and method of forming an electronic packageINTEL CORP·Filed 2018·Granted Jul 26, 2022·1 cites·21 claims
- 1265US11599750B2Edge devices utilizing personalized machine learning and methods of operating the sameINTEL CORP·Filed 2018·Granted Mar 7, 2023·1 cites·28 claims
- 1365US11552051B2Electronic device packageINTEL CORP·Filed 2017·Granted Jan 10, 2023·1 cites·21 claims
- 1462US11562978B2Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the sameINTEL CORP·Filed 2016·Granted Jan 24, 2023·1 cites·30 claims
- 1562US10910301B2Post-grind die backside power deliveryINTEL CORP·Filed 2019·Granted Feb 2, 2021·0 cites·25 claims
- 1657US10573575B2Semiconductor package with thermal finsINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·24 claims
- 1757US10483198B2Post-grind die backside power deliveryINTEL CORP·Filed 2018·Granted Nov 19, 2019·0 cites·20 claims
- 1853US2019050854A1Blockchain-based digital data exchangeINTEL CORP·Filed 2018·Application pending·0 cites
- 1951US11658079B2Temporary interconnect for use in testing a semiconductor packageINTEL CORP·Filed 2019·Granted May 23, 2023·0 cites·25 claims
- 2050US11652031B2Shrinkable package assemblyINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 2150US11171114B2Die stack with cascade and vertical connectionsINTEL CORP·Filed 2015·Granted Nov 9, 2021·0 cites·7 claims
- 2250US10090261B2Microelectronic package debug access ports and methods of fabricating the sameINTEL CORP·Filed 2017·Granted Oct 2, 2018·0 cites·14 claims
- 2349US9646952B2Microelectronic package debug access portsINTEL CORP·Filed 2015·Granted May 9, 2017·0 cites·16 claims
- 2448US11064612B2Buried electrical debug access portINTEL CORP·Filed 2016·Granted Jul 13, 2021·0 cites·17 claims
- 2547US11495547B2Fiber reinforced stiffenerINTEL CORP·Filed 2018·Granted Nov 8, 2022·0 cites·19 claims
- 2646US12347784B2Interposer with step featureINTEL CORP·Filed 2019·Granted Jul 1, 2025·0 cites·14 claims
- 2746US11749653B2Multi-die, vertical-wire package-in-package apparatus, and methods of making sameINTEL CORP·Filed 2017·Granted Sep 5, 2023·0 cites·12 claims
- 2846US2018158764A13d chip assemblies using stacked leadframesINTEL CORP·Filed 2018·Application pending·0 cites
- 2945US11948917B2Die over mold stacked semiconductor packageINTEL CORP·Filed 2019·Granted Apr 2, 2024·0 cites·21 claims
- 3042US2020294827A1Needle dispenser for dispensing and collecting an underfill encapsulantINTEL CORP·Filed 2019·Application pending·0 cites
- 3141US2019047462A1Modular configurable platform architecture for ca/ad vehiclesINTEL CORP·Filed 2018·Application pending·0 cites
- 3236US2019279954A1Microelectronic device stack having a ground shielding layerINTEL CORP·Filed 2016·Application pending·0 cites
- 3336US2019326249A1Multi-point stacked die wirebonding for improved power deliveryINTEL CORP·Filed 2016·Application pending·0 cites
- 3435US11901274B2Packaged integrated circuit device with recess structureINTEL CORP·Filed 2015·Granted Feb 13, 2024·0 cites·20 claims
- 3530US2005067694A1Spacerless die stackingFiled 2003·Application pending·0 cites
- 3629US2006060845A1Bond pad redistribution layer for thru semiconductor vias and probe touchdownRAMANUJA NARAHARI·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →