Inventor · disambiguated record
Jackson Chung Peng Kong
Also filed as: KONG JACKSON · KONG JACKSON CHUNG PENG
118 granted patents·44 pending applications·206 citations·filing 2012–2025
99Inventor score
Top patents by PatentIndex Score
162 records- 0197US10978434B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 13, 2021·5 cites·20 claims
- 0296US11652026B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2022·Granted May 16, 2023·2 cites·20 claims
- 0396US11282780B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2020·Granted Mar 22, 2022·3 cites·12 claims
- 0495US10903142B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2019·Granted Jan 26, 2021·8 cites·22 claims
- 0594US11375617B2Three dimensional foldable substrate with vertical side interfaceINTEL CORP·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0694US10580761B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 3, 2020·9 cites·21 claims
- 0794US9136251B2Method to enable controlled side chip interconnection for 3D integrated packaging systemCHEAH BOK ENG·Filed 2012·Granted Sep 15, 2015·16 cites·30 claims
- 0893US10651127B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted May 12, 2020·10 cites·7 claims
- 0993US10503211B2Multi-orientation display deviceINTEL CORP·Filed 2015·Granted Dec 10, 2019·10 cites·19 claims
- 1092US11121074B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Sep 14, 2021·3 cites·7 claims
- 1192US10014710B2Foldable fabric-based packaging solutionINTEL CORP·Filed 2015·Granted Jul 3, 2018·5 cites·17 claims
- 1290US11527479B2Stepped interposer for stacked chip packageINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·16 claims
- 1390US11367673B2Semiconductor package with hybrid through-silicon-viasINTEL CORP·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 1490US10085342B2Microelectronic device having an air core inductorINTEL CORP·Filed 2016·Granted Sep 25, 2018·6 cites·23 claims
- 1590US9812425B2Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for sameINTEL CORP·Filed 2016·Granted Nov 7, 2017·5 cites·18 claims
- 1690US2025385161A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 1789US11527463B2Hybrid ball grid array package for high speed interconnectsINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·18 claims
- 1889US9478524B2Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for sameINTEL CORP·Filed 2015·Granted Oct 25, 2016·5 cites·7 claims
- 1988US9596749B2Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal tracesINTEL CORP·Filed 2014·Granted Mar 14, 2017·8 cites·21 claims
- 2088US2024429131A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 2187US10593618B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 17, 2020·3 cites·7 claims
- 2285US10964677B2Electronic packages with stacked sitffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted Mar 30, 2021·4 cites·16 claims
- 2385US9360896B2Low-profile hinge for an electronic deviceINTEL CORP·Filed 2014·Granted Jun 7, 2016·8 cites·25 claims
- 2484US12112997B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2584US10957649B2Overpass dice stacks and methods of using sameINTEL CORP·Filed 2016·Granted Mar 23, 2021·4 cites·27 claims
- 2684US10633898B2Micro-hinge for an electronic deviceINTEL CORP·Filed 2018·Granted Apr 28, 2020·2 cites·20 claims
- 2783US12080628B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 2883US11521932B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 6, 2022·1 cites·21 claims
- 2983US10998261B2Over-molded IC package with in-mold capacitorINTEL CORP·Filed 2018·Granted May 4, 2021·4 cites·8 claims
- 3083US10910325B2Integrated circuit packages with conductive element having cavities housing electrically connected embedded componentsINTEL CORP·Filed 2018·Granted Feb 2, 2021·3 cites·24 claims
- 3182US11574877B2Semiconductor miniaturization through component placement on stepped stiffenerINTEL CORP·Filed 2020·Granted Feb 7, 2023·1 cites·14 claims
- 3281US11398415B2Stacked through-silicon vias for multi-device packagesINTEL CORP·Filed 2019·Granted Jul 26, 2022·3 cites·18 claims
- 3381US11393758B2Power delivery for embedded interconnect bridge devices and methodsINTEL CORP·Filed 2019·Granted Jul 19, 2022·3 cites·13 claims
- 3480US10840177B2Interposer with flexible portionINTEL CORP·Filed 2019·Granted Nov 17, 2020·2 cites·20 claims
- 3580US10319698B2Microelectronic device package having alternately stacked dieINTEL CORP·Filed 2016·Granted Jun 11, 2019·3 cites·15 claims
- 3679US2024395722A1Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 3778US12142570B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 3878US11164827B2Substrate with gradiated dielectric for reducing impedance mismatchINTEL CORP·Filed 2017·Granted Nov 2, 2021·2 cites·17 claims
- 3978US10950552B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 4077US10978407B2Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling sameINTEL CORP·Filed 2019·Granted Apr 13, 2021·2 cites·22 claims
- 4177US10158339B2Capacitive compensation structures using partially meshed ground planesINTEL CORP·Filed 2015·Granted Dec 18, 2018·2 cites·11 claims
- 4276US10396047B2Semiconductor package with package components disposed on a package substrate within a footprint of a dieINTEL CORP·Filed 2018·Granted Aug 27, 2019·2 cites·22 claims
- 4376USD773452SElectronic device with flexible hingeINTEL CORP·Filed 2015·Granted Dec 6, 2016·17 cites·1 claims
- 4475US11393741B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2021·Granted Jul 19, 2022·0 cites·11 claims
- 4575US10079158B2Vertical trench routing in a substrateINTEL CORP·Filed 2014·Granted Sep 18, 2018·3 cites·17 claims
- 4674US2023409084A1Multi-orientation display deviceINTEL CORP·Filed 2023·Application pending·0 cites
- 4773US11758662B2Three dimensional foldable substrate with vertical side interfaceINTEL CORP·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 4873US11195801B2Embedded reference layers for semiconductor package substratesINTEL CORP·Filed 2019·Granted Dec 7, 2021·1 cites·19 claims
- 4973US10153253B2Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatusINTEL CORP·Filed 2016·Granted Dec 11, 2018·2 cites·19 claims
- 5071US12002747B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
Showing the top 50 of 162 patent records by PatentIndex Score.
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