Inventor · disambiguated record
Ching-Liou Huang
Also filed as: HUANG CHING-LIOU
13 granted patents·2 pending applications·28 citations·filing 2011–2023
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0187US8633588B2Semiconductor packageLIN TZU-HUNG·Filed 2011·Granted Jan 21, 2014·8 cites·20 claims
- 0284US9142526B2Semiconductor package with solder resist capped trace to prevent underfill delaminationMEDIATEK INC·Filed 2013·Granted Sep 22, 2015·5 cites·20 claims
- 0381US9640505B2Semiconductor package with trace covered by solder resistMEDIATEK INC·Filed 2015·Granted May 2, 2017·3 cites·18 claims
- 0477US8987897B2Semiconductor packageCHAN KUEI-TI·Filed 2011·Granted Mar 24, 2015·5 cites·24 claims
- 0576US9209148B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Dec 8, 2015·2 cites·17 claims
- 0673US9659893B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 0772US8502377B2Package substrate for bump on trace interconnectionLIN TZU-HUNG·Filed 2011·Granted Aug 6, 2013·2 cites·20 claims
- 0863US9972593B2Semiconductor packageMEDIATEK INC·Filed 2014·Granted May 15, 2018·1 cites·32 claims
- 0960US2025201786A1Package comprising integrated devices and a passive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1057US11437307B2Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second directionQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·14 claims
- 1155US10312210B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Jun 4, 2019·0 cites·14 claims
- 1252US12362269B2Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Jul 15, 2025·0 cites·37 claims
- 1352US10916494B2Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second directionQUALCOMM INC·Filed 2019·Granted Feb 9, 2021·0 cites·12 claims
- 1451US9548271B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Jan 17, 2017·0 cites·20 claims
- 1542US2014042615A1Flip-chip packageMEDIATEK INC·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →