Assignee
LIN TZU-HUNG
TW·3 granted patents·3 pending applications·17 citations·filing 2011–2016
Top patents by PatentIndex Score
6 records- 0187US8633588B2Semiconductor packageLIN TZU-HUNG·Filed 2011·Granted Jan 21, 2014·8 cites·20 claims
- 0287US8390119B2Flip chip package utilizing trace bump trace interconnectionLIN TZU-HUNG·Filed 2011·Granted Mar 5, 2013·7 cites·20 claims
- 0372US8502377B2Package substrate for bump on trace interconnectionLIN TZU-HUNG·Filed 2011·Granted Aug 6, 2013·2 cites·20 claims
- 0447US2012267779A1Semiconductor packageLIN TZU-HUNG·Filed 2012·Application pending·0 cites
- 0533US2016180048A1Cloud-based medical information retrieval method and system thereofLIN TZU-HUNG·Filed 2015·Application pending·0 cites
- 0628US2017004288A1Interactive and multimedia medical report system and method thereofLIN TZU-HUNG·Filed 2016·Application pending·0 cites
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