Inventor · disambiguated record
Ming-Chia Wu
Also filed as: WU MING · WU MING C · WU MING-CHIA
21 granted patents·4 pending applications·355 citations·filing 2000–2022
95Inventor score
Files withCYNTEC CO LTD8DELTA ELECTRONICS INC4OPVISTA INC3GLOBE UNION IND CORP2CALIFORNIA INST OF TECHN1
Top patents by PatentIndex Score
25 records- 0197US6525857B1Method and apparatus for interleaved optical single sideband modulationOPVISTA INC·Filed 2000·Granted Feb 25, 2003·132 cites·15 claims
- 0296US9984996B2Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductorCYNTEC CO LTD·Filed 2014·Granted May 29, 2018·20 cites·17 claims
- 0395US7206520B2Method and apparatus for interleaved optical single sideband modulationOPVISTA INC·Filed 2006·Granted Apr 17, 2007·42 cites·13 claims
- 0495US7003231B2Method and apparatus for interleaved optical single sideband modulationOPVISTA INC·Filed 2001·Granted Feb 21, 2006·47 cites·67 claims
- 0591US6535315B1Optical fiber transmitter for simultaneously suppressing stimulated brillouin scattering and self/external-phase modulation-induced nolinear distortions in a long-distance broadband distribution systemNEW ELITE TECHNOLOGIES INC·Filed 2000·Granted Mar 18, 2003·63 cites·20 claims
- 0686US7448899B2Connecting module for communicationDELTA ELECTRONICS INC·Filed 2006·Granted Nov 11, 2008·12 cites·16 claims
- 0780US11067606B2Current sensing moduleCYNTEC CO LTD·Filed 2019·Granted Jul 20, 2021·3 cites·25 claims
- 0878US11098738B2Transceiver moduleDELTA ELECTRONICS INC·Filed 2018·Granted Aug 24, 2021·4 cites·18 claims
- 0975US10297573B2Three-dimensional package structure and the method to fabricate thereofCYNTEC CO LTD·Filed 2018·Granted May 21, 2019·1 cites·18 claims
- 1073US9655253B2Method of fabrication of encapsulated electronics devices mounted on a redistribution layerLU BAU-RU·Filed 2013·Granted May 16, 2017·2 cites·11 claims
- 1173US7378655B2Apparatus and method for sensing electromagnetic radiation using a tunable deviceCALIFORNIA INST OF TECHN·Filed 2004·Granted May 27, 2008·16 cites·25 claims
- 1272US10529680B2Encapsulated electronic device mounted on a redistribution layerCYNTEC CO LTD·Filed 2017·Granted Jan 7, 2020·1 cites·18 claims
- 1368US9911715B2Three-dimensional package structure and the method to fabricate thereofCYNTEC CO LTD·Filed 2014·Granted Mar 6, 2018·1 cites·19 claims
- 1468US9859250B2Substrate and the method to fabricate thereofCYNTEC CO LTD·Filed 2014·Granted Jan 2, 2018·1 cites·11 claims
- 1567US9234340B2Mounting assembly for a toiletGLOBE UNION IND CORP·Filed 2013·Granted Jan 12, 2016·2 cites·8 claims
- 1661US10854575B2Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structureCYNTEC CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·8 claims
- 1759US10128214B2Substrate and the method to fabricate thereofCYNTEC CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·20 claims
- 1858US7597487B2Optical communication deviceDELTA ELECTRONICS INC·Filed 2008·Granted Oct 6, 2009·1 cites·18 claims
- 1953US2025229510A1Composite structure and its preparation method and useLEICA BIOSYSTEMS NUSSLOCH GMBH·Filed 2022·Application pending·0 cites
- 2048US2010126612A1Water flow temperature control systemGLOBE UNION IND CORP·Filed 2008·Application pending·0 cites
- 2147US6921870B2Shifting mechanism for electric vehiclesLINK TREASURE LTD·Filed 2003·Granted Jul 26, 2005·7 cites·20 claims
- 2245US8820197B2Hand tool with replacement handleWU MING-CHIA·Filed 2012·Granted Sep 2, 2014·0 cites·8 claims
- 2341US7397643B2Protection circuitDELTA ELECTRONICS INC·Filed 2006·Granted Jul 8, 2008·0 cites·10 claims
- 2441US2017370535A1Externally-hung lamp assemblyGONG FONG ENTPR CO LTD·Filed 2016·Application pending·0 cites
- 2540US2010215360A1Optical network unit and abnormal detecting & power monitoring method thereofWENG CHIA-KAI·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →