Inventor · disambiguated record
Masaya Uyama
Also filed as: UYAMA MASAYA
37 granted patents·3 pending applications·52 citations·filing 2007–2025
95Inventor score
Top patents by PatentIndex Score
40 records- 0193US11001062B2Liquid ejection head and a manufacturing method of the sameCANON KK·Filed 2019·Granted May 11, 2021·6 cites·10 claims
- 0291US11511548B2Liquid ejection apparatus and liquid tankCANON KK·Filed 2021·Granted Nov 29, 2022·2 cites·8 claims
- 0388US10343403B2Method for forming film and method for manufacturing inkjet print headCANON KK·Filed 2017·Granted Jul 9, 2019·3 cites·20 claims
- 0486US11020971B2Liquid ejection headCANON KK·Filed 2019·Granted Jun 1, 2021·2 cites·13 claims
- 0586US10286664B2Liquid ejection head, method for manufacturing the same, and printing methodCANON KK·Filed 2017·Granted May 14, 2019·2 cites·19 claims
- 0686US8623674B2Method of manufacturing liquid ejection head substrateUYAMA MASAYA·Filed 2012·Granted Jan 7, 2014·6 cites·15 claims
- 0785US2025269645A1Liquid ejection head and method for manufacturing the sameCANON KK·Filed 2025·Application pending·0 cites
- 0884US8205967B2Liquid ejection head and manufacturing method thereofUYAMA MASAYA·Filed 2009·Granted Jun 26, 2012·7 cites·3 claims
- 0981US8445298B2Process of producing liquid discharge head base materialTAKEUCHI SOUTA·Filed 2010·Granted May 21, 2013·3 cites·20 claims
- 1081US8240815B2Recording element substrate, and inkjet head and its production methodUYAMA MASAYA·Filed 2010·Granted Aug 14, 2012·3 cites·9 claims
- 1180US12311667B2Liquid ejection head and method for manufacturing the sameCANON KK·Filed 2022·Granted May 27, 2025·0 cites·14 claims
- 1279US10150292B2Liquid discharge head, manufacturing method therefor, and recording methodCANON KK·Filed 2017·Granted Dec 11, 2018·1 cites·17 claims
- 1378US12479206B2Wafer, and liquid ejection chipCANON KK·Filed 2023·Granted Nov 25, 2025·0 cites·8 claims
- 1475US12220924B2Liquid ejection apparatus and liquid tankCANON KK·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 1575US8877290B2Method for producing liquid-ejection headCANON KK·Filed 2013·Granted Nov 4, 2014·2 cites·14 claims
- 1674US8141987B2Ink jet recording head, manufacturing method thereof, and electron deviceHAYAKAWA KAZUHIRO·Filed 2009·Granted Mar 27, 2012·4 cites·4 claims
- 1771US9102150B2Liquid ejection head and method for manufacturing sameCANON KK·Filed 2014·Granted Aug 11, 2015·1 cites·13 claims
- 1870US11081349B2Method of forming film on substrate and method of manufacturing liquid ejection headCANON KK·Filed 2019·Granted Aug 3, 2021·1 cites·10 claims
- 1970US9205654B2Method of manufacturing a liquid ejection headCANON KK·Filed 2014·Granted Dec 8, 2015·1 cites·8 claims
- 2069US9548207B2Method of etching a silicon substrateCANON KK·Filed 2014·Granted Jan 17, 2017·2 cites·6 claims
- 2167US8448333B2Method for manufacturing wiring board and method for manufacturing inkjet printhead substrateUYAMA MASAYA·Filed 2009·Granted May 28, 2013·4 cites·4 claims
- 2266US7926909B2Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor deviceCANON KK·Filed 2008·Granted Apr 19, 2011·2 cites·7 claims
- 2360US2025074051A1Liquid ejection headCANON KK·Filed 2024·Application pending·0 cites
- 2455US11027548B2Liquid ejection head and method of manufacturing sameCANON KK·Filed 2019·Granted Jun 8, 2021·0 cites·19 claims
- 2554US2015136024A1Liquid discharge headCANON KK·Filed 2013·Application pending·0 cites
- 2653US11135838B2Liquid ejection head and method of manufacturing sameCANON KK·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
- 2753US10906304B2Semiconductor element, recording element substrate, and liquid discharge headCANON KK·Filed 2019·Granted Feb 2, 2021·0 cites·12 claims
- 2851US9511588B2Method for processing silicon substrateCANON KK·Filed 2014·Granted Dec 6, 2016·0 cites·17 claims
- 2950US11161351B2Liquid ejection headCANON KK·Filed 2019·Granted Nov 2, 2021·0 cites·14 claims
- 3050US9914298B2Liquid ejection headCANON KK·Filed 2016·Granted Mar 13, 2018·0 cites·20 claims
- 3149US10632754B2Perforated substrate processing method and liquid ejection head manufacturing methodCANON KK·Filed 2018·Granted Apr 28, 2020·0 cites·14 claims
- 3248US9004666B2Process for producing substrate and substrate processing methodUYAMA MASAYA·Filed 2011·Granted Apr 14, 2015·0 cites·15 claims
- 3347US7922922B2Ink jet print head manufacturing method and ink jet print headCANON KK·Filed 2007·Granted Apr 12, 2011·0 cites·10 claims
- 3445US9393781B2Liquid-discharging head and method of producing the sameTERUI MAKOTO·Filed 2008·Granted Jul 19, 2016·0 cites·11 claims
- 3544US8408681B2Liquid discharge head having an increased rigiditySAKAI TOSHIYASU·Filed 2011·Granted Apr 2, 2013·0 cites·9 claims
- 3643US10538090B2Method for manufacturing perforated substrate, method for manufacturing liquid ejection head, and method for detecting flawCANON KK·Filed 2017·Granted Jan 21, 2020·0 cites·16 claims
- 3742US9216575B2Recording-element substrate and liquid ejection apparatusCANON KK·Filed 2015·Granted Dec 22, 2015·0 cites·20 claims
- 3841US9623655B2Liquid discharge head and method for manufacturing the sameCANON KK·Filed 2015·Granted Apr 18, 2017·0 cites·7 claims
- 3939US9789689B2Method of forming through-substrateCANON KK·Filed 2015·Granted Oct 17, 2017·0 cites·14 claims
- 4035US9676193B2Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etchingCANON KK·Filed 2015·Granted Jun 13, 2017·0 cites·10 claims
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