Assignee
UYAMA MASAYA
JP·5 granted patents·20 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0186US8623674B2Method of manufacturing liquid ejection head substrateUYAMA MASAYA·Filed 2012·Granted Jan 7, 2014·6 cites·15 claims
- 0284US8205967B2Liquid ejection head and manufacturing method thereofUYAMA MASAYA·Filed 2009·Granted Jun 26, 2012·7 cites·3 claims
- 0381US8240815B2Recording element substrate, and inkjet head and its production methodUYAMA MASAYA·Filed 2010·Granted Aug 14, 2012·3 cites·9 claims
- 0467US8448333B2Method for manufacturing wiring board and method for manufacturing inkjet printhead substrateUYAMA MASAYA·Filed 2009·Granted May 28, 2013·4 cites·4 claims
- 0548US9004666B2Process for producing substrate and substrate processing methodUYAMA MASAYA·Filed 2011·Granted Apr 14, 2015·0 cites·15 claims
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