Inventor · disambiguated record

Ching-Wen Hsaio

Also filed as: HSAIO CHING-WEN

2 granted patents·2 citations·filing 2013–2015

40Inventor score

Technology areasH10D H10W

Files withINVENSAS CORP2

Top patents by PatentIndex Score

2 records

0171US9059181B2Wafer leveled chip packaging structure and method thereofINVENSAS CORP·Filed 2013·Granted Jun 16, 2015·2 cites·14 claims
0236US9601474B2Electrically stackable semiconductor wafer and chip packagesINVENSAS CORP·Filed 2015·Granted Mar 21, 2017·0 cites·16 claims

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Ching-Wen Hsaio — Patent Inventor | PatentIndex