Inventor · disambiguated record
John Kim
Also filed as: KIM II JOHN · KIM II JOHN C · KIM JOHN · KIM JOHN C
12 granted patents·1 pending application·205 citations·filing 1991–2022
90Inventor score
Files withDAEWON SEMICONDUCTOR PACKAGING IND COMPANY3EXPEDIA INC3GRAMMATIS DAN A1KIM JOHN C1NORTEL NETWORKS CORP1
Top patents by PatentIndex Score
13 records- 0193US6649009B1Process for placing one faceted stone inside a larger faceted stone to form a single jewelry stoneFiled 2002·Granted Nov 18, 2003·50 cites·6 claims
- 0286US10956995B1User-specific travel offersEXPEDIA INC·Filed 2016·Granted Mar 23, 2021·16 cites·20 claims
- 0378US5263233AMethod and apparatus for flocking an article and the article produced therebyKIM JOHN C·Filed 1991·Granted Nov 23, 1993·54 cites·9 claims
- 0476US6214141B1Decorative flocking techniquesFiled 1998·Granted Apr 10, 2001·32 cites·28 claims
- 0565US11764133B2Tape carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2022·Granted Sep 19, 2023·0 cites·16 claims
- 0660US6094361AAssemblies of printed circuit boards and flexible containers thereforNORTEL NETWORKS CORP·Filed 1997·Granted Jul 25, 2000·23 cites·32 claims
- 0750US11362025B2Tape carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2018·Granted Jun 14, 2022·0 cites·12 claims
- 0849US6048422AMethod of applying glitter and the like to non-planar surfaces and three-dimensional articlesFiled 1998·Granted Apr 11, 2000·10 cites·23 claims
- 0947US11580584B2Managing item queriesEXPEDIA INC·Filed 2016·Granted Feb 14, 2023·0 cites·18 claims
- 1045US8839478B2Railroad track cleaning assemblies and apparatusGRAMMATIS DAN A·Filed 2011·Granted Sep 23, 2014·1 cites·18 claims
- 1144US5651317ARailroad tie exchanger attachmentSWINGMASTER CORP·Filed 1996·Granted Jul 29, 1997·19 cites·11 claims
- 1240US9519678B2Managing item queriesEXPEDIA INC·Filed 2012·Granted Dec 13, 2016·0 cites·25 claims
- 1336US2019067061A1Rigid carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →