Inventor · disambiguated record
Nim Tea
Also filed as: TEA NIM · TEA NIM H · TEA NIM HAK
21 granted patents·5 pending applications·378 citations·filing 1998–2017
95Inventor score
Top patents by PatentIndex Score
26 records- 0192US7271022B2Process for forming microstructuresTOUCHDOWN TECHNOLOGIES INC·Filed 2005·Granted Sep 18, 2007·33 cites·31 claims
- 0292US7245135B2Post and tip design for a probe contactTOUCHDOWN TECHNOLOGIES INC·Filed 2005·Granted Jul 17, 2007·23 cites·26 claims
- 0390US7365553B2Probe card assemblyTOUCHDOWN TECHNOLOGIES INC·Filed 2005·Granted Apr 29, 2008·15 cites·40 claims
- 0490US7264984B2Process for forming MEMSTOUCHDOWN TECHNOLOGIES INC·Filed 2004·Granted Sep 4, 2007·60 cites·36 claims
- 0589US6079873AMicron-scale differential scanning calorimeter on a chipUS COMMERCE·Filed 1998·Granted Jun 27, 2000·114 cites·20 claims
- 0684US7759952B2Method of forming probe card assemblyTOUCHDOWN TECHNOLOGIES INC·Filed 2007·Granted Jul 20, 2010·8 cites·12 claims
- 0780US7589542B2Hybrid probe for testing semiconductor devicesTOUCHDOWN TECHNOLOGIES INC·Filed 2007·Granted Sep 15, 2009·9 cites·28 claims
- 0879US7362119B2Torsion spring probe contactor designTOUCHDOWN TECHNOLOGIES INC·Filed 2005·Granted Apr 22, 2008·9 cites·46 claims
- 0974US9926192B2Methods for stiction reduction in MEMS sensorsINVENSENSE INC·Filed 2015·Granted Mar 27, 2018·2 cites·16 claims
- 1074US7378734B2Stacked contact bumpTOUCHDOWN TECHNOLOGIES INC·Filed 2006·Granted May 27, 2008·10 cites·21 claims
- 1173US10794728B2Device and method for sensor calibrationINVENSENSE INC·Filed 2017·Granted Oct 6, 2020·1 cites·27 claims
- 1270US6666825B2Ultrasound transducer for improving resolution in imaging systemGEN ELECTRIC·Filed 2001·Granted Dec 23, 2003·54 cites·25 claims
- 1369US9136165B2Methods for stiction reduction in MEMS sensorsINVENSENSE INC·Filed 2013·Granted Sep 15, 2015·2 cites·12 claims
- 1469US7728612B2Probe card assembly and method of forming sameTOUCHDOWN TECHNOLOGIES INC·Filed 2007·Granted Jun 1, 2010·2 cites·34 claims
- 1568US6171880B1Method of manufacture of convective accelerometersUS COMMERCE·Filed 1999·Granted Jan 9, 2001·29 cites·16 claims
- 1667US7724010B2Torsion spring probe contactor designTOUCHDOWN TECHNOLOGIES INC·Filed 2007·Granted May 25, 2010·4 cites·21 claims
- 1753US9804007B2Device and method for sensor calibrationINVENSENSE INC·Filed 2014·Granted Oct 31, 2017·0 cites·26 claims
- 1850US7538567B2Probe card with balanced lateral forceTOUCHDOWN TECHNOLOGIES INC·Filed 2006·Granted May 26, 2009·2 cites·10 claims
- 1943US7922888B2Post and tip design for a probe contactTOUCHDOWN TECHNOLOGIES INC·Filed 2007·Granted Apr 12, 2011·0 cites·14 claims
- 2042US2014210019A1Low-cost package for integrated mems sensorsINVENSENSE INC·Filed 2013·Application pending·0 cites
- 2141US7772859B2Probe for testing semiconductor devices with features that increase stress toleranceTOUCHDOWN TECHNOLOGIES INC·Filed 2008·Granted Aug 10, 2010·0 cites·29 claims
- 2241US7437071B2Distributive optical switching control systemCISCO TECH INC·Filed 2002·Granted Oct 14, 2008·1 cites·24 claims
- 2339US2013206990A1Background Limited Focal Plane Array AssemblyHSU YING·Filed 2012·Application pending·0 cites
- 2439US2011303404A1Wear-Resistant Conformal Coating for Micro-Channel StructureTEA NIM·Filed 2011·Application pending·0 cites
- 2537US2007057685A1Lateral interposer contact design and probe card assemblyTOUCHDOWN TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2637US2007202683A1Stacked contact bumpTOUCHDOWN TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
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