Inventor · disambiguated record
Yasuhiro Motoyama
Also filed as: MOTOYAMA YASUHIRO
20 granted patents·6 pending applications·218 citations·filing 1998–2011
95Inventor score
Top patents by PatentIndex Score
26 records- 0193US6696849B2Fabrication method of semiconductor integrated circuit device and its testing apparatusRENESAS TECH CORP·Filed 2001·Granted Feb 24, 2004·75 cites·6 claims
- 0287US7776626B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Aug 17, 2010·15 cites·24 claims
- 0385US7271015B2Manufacturing method of semiconductor integrated circuit device and probe cardRENESAS TECH CORP·Filed 2005·Granted Sep 18, 2007·12 cites·3 claims
- 0483US8357933B2Manufacturing method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 22, 2013·6 cites·20 claims
- 0580US7351597B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Apr 1, 2008·10 cites·9 claims
- 0679US7219422B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted May 22, 2007·21 cites·8 claims
- 0779US6455335B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2000·Granted Sep 24, 2002·17 cites·10 claims
- 0877US6566150B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2002·Granted May 20, 2003·15 cites·1 claims
- 0972US7901958B2Fabrication method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 8, 2011·2 cites·18 claims
- 1068US7235413B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jun 26, 2007·13 cites·17 claims
- 1167US7688086B2Fabrication method of semiconductor integrated circuit device and probe cardRENESAS TECH CORP·Filed 2006·Granted Mar 30, 2010·7 cites·25 claims
- 1265US7407823B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Aug 5, 2008·2 cites·26 claims
- 1364US8062911B2Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the sameHASEBE AKIO·Filed 2007·Granted Nov 22, 2011·2 cites·9 claims
- 1461US8206997B2Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the sameHASEBE AKIO·Filed 2010·Granted Jun 26, 2012·1 cites·14 claims
- 1553US6197603B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 1652US7517707B2Manufacturing method of semiconductor integrated circuit device and probe cardRENESAS TECH CORP·Filed 2007·Granted Apr 14, 2009·1 cites·7 claims
- 1752US2008020498A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2007·Application pending·0 cites
- 1850US7198962B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2003·Granted Apr 3, 2007·3 cites·5 claims
- 1950US2011175634A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2011·Application pending·0 cites
- 2050US2011136272A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2011·Application pending·0 cites
- 2148US7598100B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Oct 6, 2009·4 cites·21 claims
- 2246US7537943B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted May 26, 2009·0 cites·9 claims
- 2345US2007207559A1Fabrication method of semiconductor integrated circuit deviceHASEBE AKIO·Filed 2007·Application pending·0 cites
- 2442US2005093565A1Fabrication method of semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 2541US2004135593A1Fabrication method of semiconductor integrated circuit device and its testing apparatusFiled 2004·Application pending·0 cites
- 2631US8323992B2Method of manufacturing semiconductor integrated circuit deviceNAKAMURA SEIGO·Filed 2011·Granted Dec 4, 2012·0 cites·20 claims
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