Inventor · disambiguated record
Yukihiro Ishimaru
Also filed as: ISHIMARU YUKIHIRO
25 granted patents·8 pending applications·391 citations·filing 1999–2011
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD23PANASONIC CORP2TAKATORI MASAHIRO2ASAHI TOSHIYUKI1ISHIMARU YUKIHIRO1
Top patents by PatentIndex Score
33 records- 0195US7091593B2Circuit board with built-in electronic component and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 15, 2006·72 cites·8 claims
- 0293US7341890B2Circuit board with built-in electronic component and method for manufacturing the sameMATSUSHITA IND CO LTD·Filed 2006·Granted Mar 11, 2008·28 cites·15 claims
- 0387US7346051B2Slave device, master device and stacked deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Mar 18, 2008·18 cites·7 claims
- 0484US6687985B2Method of Manufacturing a multi-layer circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 10, 2004·38 cites·18 claims
- 0583US6281446B1Multi-layered circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 28, 2001·65 cites·8 claims
- 0682US6512183B2Electronic component mounted member and repair method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·25 cites·15 claims
- 0778US8810035B2Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure bodyNAKAMURA TAICHI·Filed 2011·Granted Aug 19, 2014·5 cites·4 claims
- 0878US8077478B2Module boardTAKATORI MASAHIRO·Filed 2006·Granted Dec 13, 2011·6 cites·3 claims
- 0977US8878559B2IC current measuring apparatus and IC current measuring adapterNAKAYAMA TAKESHI·Filed 2011·Granted Nov 4, 2014·4 cites·11 claims
- 1076US7180169B2Circuit component built-in module and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 20, 2007·19 cites·18 claims
- 1175US6853074B2Electronic part, an electronic part mounting element and a process for manufacturing such the articlesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 8, 2005·16 cites·16 claims
- 1275US6510059B2Conductive resin, electronic module using conductive resin, and method of manufacturing electronic moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 21, 2003·19 cites·23 claims
- 1374US6521144B2Conductive adhesive and connection structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 18, 2003·15 cites·14 claims
- 1473US8675369B2Module boardTAKATORI MASAHIRO·Filed 2011·Granted Mar 18, 2014·2 cites·12 claims
- 1572US6675474B2Electronic component mounted member and repair method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 13, 2004·14 cites·5 claims
- 1670US6916433B2Conductive adhesive, apparatus for mounting electronic component, and method for mounting the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jul 12, 2005·17 cites·18 claims
- 1764US6666994B2Conductive adhesive and packaging structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 23, 2003·9 cites·25 claims
- 1860US7649267B2Package equipped with semiconductor chip and method for producing samePANASONIC CORP·Filed 2006·Granted Jan 19, 2010·2 cites·13 claims
- 1960US7136543B2Mount assembly, optical transmission line and photoelectric circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 14, 2006·4 cites·18 claims
- 2058US7752749B2Electronic component mounting method and electronic component mounting devicePANASONIC CORP·Filed 2006·Granted Jul 13, 2010·2 cites·25 claims
- 2156US7151306B2Electronic part, and electronic part mounting element and an process for manufacturing such the articlesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 19, 2006·4 cites·3 claims
- 2253US2007124926A1Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 2349US6814893B2Conductive adhesive agent, packaging structure, and method for manufacturing the same structureMATSUSHITA ELECTRIC INDUSTIRAL·Filed 2003·Granted Nov 9, 2004·2 cites·7 claims
- 2448US6620345B2Conductive adhesive agent, packaging structure, and method for manufacturing the same structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 16, 2003·2 cites·7 claims
- 2547US6524721B2Conductive adhesive and packaging structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 25, 2003·2 cites·19 claims
- 2647US2009202142A1Circuit board, method for testing circuit board, and method for manufacturing circuit boardISHIMARU YUKIHIRO·Filed 2007·Application pending·0 cites
- 2746US6749774B2Conductive adhesive and connection structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 15, 2004·1 cites·7 claims
- 2846US2008296053A1Electronic component module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2945US2005199420A1Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 3043US2008298023A1Electronic component-containing module and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 3143US2009115067A1Module having built-in electronic component and method for manufacturing such moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3241US2004194999A1Wiring board, method for manufacturing a wiring board and electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 3338US2007069393A1Wiring board embedded with spherical semiconductor elementASAHI TOSHIYUKI·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yukihiro Ishimaru files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →