Inventor · disambiguated record
Kenji Yokomizo
Also filed as: YOKOMIZO KENJI
23 granted patents·4 pending applications·622 citations·filing 1992–2023
96Inventor score
Files withTOKYO ELECTRON LTD14HITACHI CABLE5FURUKAWA ELECTRIC CO LTD3MUROGA TAKEMI2KOGETSU YASUTAKA1
Top patents by PatentIndex Score
27 records- 0193US5671544ASubstrate drying apparatus and substrate drying methodTOKYO ELECTRON LTD·Filed 1996·Granted Sep 30, 1997·56 cites·15 claims
- 0293US5575079ASubstrate drying apparatus and substrate drying methodTOKYO ELECTRON LTD·Filed 1994·Granted Nov 19, 1996·48 cites·11 claims
- 0391US6780277B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2002·Granted Aug 24, 2004·61 cites·10 claims
- 0490US7108923B1Copper foil for printed circuit board with taking environmental conservation into considerationHITACHI CABLE·Filed 2005·Granted Sep 19, 2006·11 cites·10 claims
- 0589US8221897B2Rolled copper foilMUROGA TAKEMI·Filed 2008·Granted Jul 17, 2012·9 cites·10 claims
- 0684US10882783B2Optical fiber ribbon and optical fiber cableFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jan 5, 2021·4 cites·8 claims
- 0784US5730162AApparatus and method for washing substratesTOKYO ELECTRON LTD·Filed 1996·Granted Mar 24, 1998·67 cites·4 claims
- 0881US11036024B2Method for manufacturing intermittent bonding type optical fiber ribbon and intermittent bonding type optical fiber ribbonFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Jun 15, 2021·3 cites·9 claims
- 0979US5817185AMethod for washing substratesTOKYO ELECTRON LTD·Filed 1997·Granted Oct 6, 1998·48 cites·7 claims
- 1079US5297910ATransportation-transfer device for an object of treatmentTOKYO ELECTRON LTD·Filed 1992·Granted Mar 29, 1994·70 cites·10 claims
- 1176US6399517B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 1999·Granted Jun 4, 2002·44 cites·15 claims
- 1272US7842397B2Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foilHITACHI CABLE·Filed 2006·Granted Nov 30, 2010·6 cites·3 claims
- 1372US7789977B2Rolled copper foil and manufacturing method thereofHITACHI CABLE·Filed 2007·Granted Sep 7, 2010·4 cites·10 claims
- 1472US5327921AProcessing vessel for a wafer washing systemTOKYO ELECTRON LTD·Filed 1993·Granted Jul 12, 1994·58 cites·10 claims
- 1567US6558476B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2001·Granted May 6, 2003·9 cites·6 claims
- 1667US5435075ASpindrierTOKYO ELECTRON LTD·Filed 1993·Granted Jul 25, 1995·47 cites·14 claims
- 1766US5503171ASubstrates-washing apparatusTOKYO ELECTRON LTD·Filed 1993·Granted Apr 2, 1996·46 cites·18 claims
- 1857US11105992B2Optical fiber ribbon and optical fiber cableFURUKAWA ELECTRIC CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·7 claims
- 1957US8303723B2Liquid processing apparatus, liquid processing method, and storage mediumMINAMI TERUOMI·Filed 2009·Granted Nov 6, 2012·1 cites·11 claims
- 2057US6199564B1Substrate processing method and apparatusTOKYO ELECTRON LTD·Filed 1998·Granted Mar 13, 2001·19 cites·8 claims
- 2156US5890389AMethod of manufacturing modified cross-section materialHITACHI CABLE·Filed 1997·Granted Apr 6, 1999·8 cites·11 claims
- 2256US2024319461A1Optical fiber ribbon print spacing for reduced transmission lossOFS FITEL LLC·Filed 2023·Application pending·0 cites
- 2352US7270137B2Apparatus and method of securing a workpiece during high-pressure processingTOKYO ELECTRON LTD·Filed 2003·Granted Sep 18, 2007·3 cites·23 claims
- 2449US2010291402A1Rolled copper foil and manufacturing method thereofMUROGA TAKEMI·Filed 2010·Application pending·0 cites
- 2548US2009166066A1Copper foilHITACHI CABLE·Filed 2008·Application pending·0 cites
- 2648US2010255970A1Metal foil machining rollerKOGETSU YASUTAKA·Filed 2008·Application pending·0 cites
- 2734US7678199B2Substrate cleaning methodTOKYO ELECTRON LTD·Filed 2006·Granted Mar 16, 2010·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Kenji Yokomizo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →