Inventor · disambiguated record
Paul M. Gaschke
Also filed as: GASCHKE PAUL · GASCHKE PAUL M · GASCHKE PAUL MATHEW
14 granted patents·2 pending applications·841 citations·filing 1990–2007
95Inventor score
Files withIBM15
Top patents by PatentIndex Score
16 records- 0193US6275051B1Segmented architecture for wafer test and burn-inIBM·Filed 1999·Granted Aug 14, 2001·127 cites·27 claims
- 0292US5001423ADry interface thermal chuck temperature control system for semiconductor wafer testingIBM·Filed 1990·Granted Mar 19, 1991·210 cites·23 claims
- 0391US6086387ACover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testingIBM·Filed 1998·Granted Jul 11, 2000·114 cites·23 claims
- 0487US6411112B1Off-axis contact tip and dense packing design for a fine pitch probeIBM·Filed 1998·Granted Jun 25, 2002·75 cites·14 claims
- 0587US5977787ALarge area multiple-chip probe assembly and method of making the sameIBM·Filed 1997·Granted Nov 2, 1999·82 cites·31 claims
- 0684US7259580B2Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during testIBM·Filed 2005·Granted Aug 21, 2007·15 cites·17 claims
- 0783US5748007AUniversal test and burn-in socket adaptable to varying IC module thicknessIBM·Filed 1996·Granted May 5, 1998·56 cites·22 claims
- 0875US6868852B2Cold weather breathing apparatusFiled 2001·Granted Mar 22, 2005·23 cites·20 claims
- 0971US5186238ALiquid film interface cooling chuck for semiconductor wafer processingIBM·Filed 1991·Granted Feb 16, 1993·48 cites·17 claims
- 1070US6426636B1Wafer probe interface arrangement with nonresilient probe elements and support structureIBM·Filed 1998·Granted Jul 30, 2002·37 cites·11 claims
- 1167US6967556B2High power space transformerIBM·Filed 2003·Granted Nov 22, 2005·12 cites·11 claims
- 1261US5088006ALiquid film interface cooling system for semiconductor wafer processingIBM·Filed 1991·Granted Feb 11, 1992·32 cites·12 claims
- 1343US6196866B1Vertical probe housingIBM·Filed 1999·Granted Mar 6, 2001·10 cites·33 claims
- 1441US7332927B2Apparatus for temporary thermal coupling of an electronic device to a heat sink during testIBM·Filed 2007·Granted Feb 19, 2008·0 cites·20 claims
- 1538US2008143357A1High power cobra interposer wtih integrated guard plateIBM·Filed 2006·Application pending·0 cites
- 1633US2001050567A1Segmented architecture for wafer test & burn-inIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →