Inventor · disambiguated record
Leonard E. Mess
Also filed as: MESS LEONARD E
45 granted patents·1,978 citations·filing 1997–2010
99Inventor score
Top patents by PatentIndex Score
45 records- 0199US6900528B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2001·Granted May 31, 2005·229 cites·21 claims
- 0299US6294839B1Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·352 cites·16 claims
- 0398US6297960B1Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·155 cites·34 claims
- 0498US6297548B1Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·259 cites·46 claims
- 0597US7704794B2Method of forming a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 27, 2010·43 cites·54 claims
- 0696US7262506B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 28, 2007·85 cites·88 claims
- 0795US6760224B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 6, 2004·60 cites·19 claims
- 0895US6563217B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 13, 2003·76 cites·26 claims
- 0992US7829991B2Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 9, 2010·17 cites·18 claims
- 1092US6414391B1Module assembly for stacked BGA packages with a common bus bar in the assemblyMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 2, 2002·87 cites·23 claims
- 1191US6525943B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 25, 2003·36 cites·32 claims
- 1290US7408255B2Assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 5, 2008·12 cites·19 claims
- 1390US7400032B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 15, 2008·12 cites·9 claims
- 1490US6512302B2Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 28, 2003·46 cites·21 claims
- 1589US6838768B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 4, 2005·35 cites·19 claims
- 1689US6650007B2Stackable ceramic fbga for high thermal applicationsMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 18, 2003·36 cites·22 claims
- 1789US6291265B1Method of manufacturing an interposerMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 18, 2001·39 cites·24 claims
- 1889US6224936B1Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 1998·Granted May 1, 2001·47 cites·12 claims
- 1988US7999378B2Semiconductor devices including semiconductor dice in laterally offset stacked arrangementROUND ROCK RES LLC·Filed 2010·Granted Aug 16, 2011·6 cites·41 claims
- 2088US6380631B2Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 30, 2002·37 cites·18 claims
- 2184US6858926B2Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 22, 2005·24 cites·29 claims
- 2284US6558966B2Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 2001·Granted May 6, 2003·27 cites·26 claims
- 2382US7375419B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2004·Granted May 20, 2008·19 cites·36 claims
- 2481US7285442B2Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 23, 2007·6 cites·41 claims
- 2580US8049342B2Semiconductor device and method of fabrication thereofROUND ROCK RES LLC·Filed 2009·Granted Nov 1, 2011·5 cites·54 claims
- 2680US6592670B1Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 15, 2003·15 cites·22 claims
- 2777US6577019B1Alignment and orientation features for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·20 cites·19 claims
- 2877US6527999B2Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·13 cites·12 claims
- 2977US6472252B2Methods for ball grid array (BGA) encapsulation moldMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 29, 2002·21 cites·15 claims
- 3076US7279797B2Module assembly and method for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 9, 2007·4 cites·29 claims
- 3176US6007317ABall grid array (BGA) encapsulation moldMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·38 cites·5 claims
- 3275US6830719B2Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 14, 2004·11 cites·11 claims
- 3374US7998792B2Semiconductor device assemblies, electronic devices including the same and assembly methodsROUND ROCK RES LLC·Filed 2009·Granted Aug 16, 2011·3 cites·32 claims
- 3472US6764549B2Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 20, 2004·9 cites·9 claims
- 3570US7166252B2Method for reducing warpage during application and curing of encapsulant materials on a printed circuit boardMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 23, 2007·8 cites·11 claims
- 3667US5923959ABall grid array (BGA) encapsulation moldMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 13, 1999·25 cites·13 claims
- 3761US6777965B1Interposer for electrically coupling a semiconductive device to an electrical apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 17, 2004·19 cites·27 claims
- 3859US7229905B2Alignment and orientation features for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 12, 2007·1 cites·8 claims
- 3959US6869869B2Alignment and orientation features for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 22, 2005·7 cites·8 claims
- 4052US6864700B2System for electronically coupling a device to an electrical apparatusMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 8, 2005·3 cites·61 claims
- 4152US6815261B2Encapsulation method in a molding machine for an electronic deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 9, 2004·4 cites·14 claims
- 4252US6335221B1Ball grid array (BGA) encapsulation moldMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 1, 2002·12 cites·15 claims
- 4351US7396702B2Module assembly and method for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 8, 2008·0 cites·20 claims
- 4451US6690188B2Method of testing a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 10, 2004·3 cites·27 claims
- 4551US6164946ABall grid array (BGA) encapsulation moldMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 26, 2000·12 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →