Inventor · disambiguated record
Takashi Hozumi
Also filed as: HOZUMI TAKASHI
14 granted patents·3 pending applications·366 citations·filing 1996–2017
93Inventor score
Top patents by PatentIndex Score
17 records- 0189US6329711B1Semiconductor device and mounting structureFUJITSU LTD·Filed 1998·Granted Dec 11, 2001·122 cites·13 claims
- 0288US9614411B2Canned motor and vacuum pumpEBARA CORP·Filed 2013·Granted Apr 4, 2017·7 cites·30 claims
- 0387US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 0486US6541848B2Semiconductor device including stud bumps as external connection terminalsFUJITSU LTD·Filed 1998·Granted Apr 1, 2003·58 cites·9 claims
- 0581US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 0674US6507092B1Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the sameFUJITSU LTD·Filed 2000·Granted Jan 14, 2003·21 cites·9 claims
- 0773US5844309AAdhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the compositionFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·46 cites·14 claims
- 0870US9429166B2Sealing structure, vacuum pump motor including same sealing structure, and vacuum pumpEBARA CORP·Filed 2013·Granted Aug 30, 2016·2 cites·7 claims
- 0969US9291155B2Vacuum pump motor and vacuum pump having balance ringsEBARA CORP·Filed 2013·Granted Mar 22, 2016·1 cites·12 claims
- 1068US8251678B2Vacuum pump unitHOZUMI TAKASHI·Filed 2007·Granted Aug 28, 2012·7 cites·19 claims
- 1160US10320260B2Canned motor and vacuum pumpEBARA CORP·Filed 2017·Granted Jun 11, 2019·0 cites·4 claims
- 1257US9660496B2Canned motor and vacuum pumpEBARA CORP·Filed 2015·Granted May 23, 2017·0 cites·5 claims
- 1356US6515347B1Wafer level semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2000·Granted Feb 4, 2003·7 cites·11 claims
- 1442USD629422SPump mount base for vacuum compression apparatusEBARA CORP·Filed 2008·Granted Dec 21, 2010·6 cites·1 claims
- 1540US2003132533A1Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frameFUJITSU LTD·Filed 2003·Application pending·0 cites
- 1632US2002127776A1Semiconductor device having an organic material layer and method for making the sameFUJITSU LTD·Filed 2001·Application pending·0 cites
- 1728US2001045643A1Semiconductor device keeping structural integrity under heat-generated stressFiled 1999·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →