Inventor · disambiguated record
Fritz Redeker
Also filed as: REDEKER FRITZ · REDEKER FRITZ C
73 granted patents·27 pending applications·974 citations·filing 1997–2015
99Inventor score
Top patents by PatentIndex Score
100 records- 0199US5882424APlasma cleaning of a CVD or etch reactor using a low or mixed frequency excitation fieldAPPLIED MATERIALS INC·Filed 1997·Granted Mar 16, 1999·325 cites·30 claims
- 0294US7615480B2Methods of post-contact back end of the line through-hole via integrationLAM RES CORP·Filed 2007·Granted Nov 10, 2009·22 cites·17 claims
- 0393US6299741B1Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Oct 9, 2001·110 cites·10 claims
- 0492US7829152B2Electroless plating method and apparatusLAM RES CORP·Filed 2006·Granted Nov 9, 2010·18 cites·8 claims
- 0592US7234477B2Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfacesLAM RES CORP·Filed 2002·Granted Jun 26, 2007·55 cites·30 claims
- 0692US6951042B1Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the sameLAM RES CORP·Filed 2003·Granted Oct 4, 2005·50 cites·20 claims
- 0791US8241701B2Processes and systems for engineering a barrier surface for copper depositionDORDI YEZDI·Filed 2006·Granted Aug 14, 2012·16 cites·28 claims
- 0890US8771804B2Processes and systems for engineering a copper surface for selective metal depositionDORDI YEZDI·Filed 2006·Granted Jul 8, 2014·16 cites·27 claims
- 0990US8622020B2Simultaneous electroless plating of two substratesTHIE WILLIAM·Filed 2010·Granted Jan 7, 2014·10 cites·17 claims
- 1090US8287647B2Apparatus and method for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Granted Oct 16, 2012·12 cites·7 claims
- 1189US6451697B1Method for abrasive-free metal CMP in passivation domainAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·38 cites·15 claims
- 1288US7179154B1Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassetteLAM RES CORP·Filed 2005·Granted Feb 20, 2007·12 cites·19 claims
- 1386US8916232B2Method for barrier interface preparation of copper interconnectYOON HYUNGSUK ALEXANDER·Filed 2006·Granted Dec 23, 2014·9 cites·30 claims
- 1486US7810513B1Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the sameLAM RES CORP·Filed 2005·Granted Oct 12, 2010·10 cites·16 claims
- 1585US8026605B2Interconnect structure and method of manufacturing a damascene structureLAM RES CORP·Filed 2006·Granted Sep 27, 2011·8 cites·18 claims
- 1685US7799141B2Method and system for using a two-phases substrate cleaning compoundLAM RES CORP·Filed 2006·Granted Sep 21, 2010·8 cites·24 claims
- 1785US7584761B1Wafer edge surface treatment with liquid meniscusLAM RES CORP·Filed 2005·Granted Sep 8, 2009·10 cites·8 claims
- 1885US7521358B2Process integration scheme to lower overall dielectric constant in BEoL interconnect structuresLAM RES CORP·Filed 2007·Granted Apr 21, 2009·11 cites·25 claims
- 1985US7383843B2Method and apparatus for processing wafer surfaces using thin, high velocity fluid layerLAM RES CORP·Filed 2004·Granted Jun 10, 2008·28 cites·17 claims
- 2083US8747960B2Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicideDORDI YEZDI·Filed 2006·Granted Jun 10, 2014·11 cites·20 claims
- 2183US8519461B2Device with post-contact back end of line through-hole via integrationBOYD JOHN·Filed 2012·Granted Aug 27, 2013·4 cites·5 claims
- 2283US7615486B2Apparatus and method for integrated surface treatment and deposition for copper interconnectLAM RES CORP·Filed 2007·Granted Nov 10, 2009·7 cites·22 claims
- 2383US7032269B2Brush scrubbing-high frequency resonating substrate processing systemLAM RES CORP·Filed 2005·Granted Apr 25, 2006·7 cites·14 claims
- 2481US8475599B2Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutionsFREER ERIK M·Filed 2006·Granted Jul 2, 2013·6 cites·12 claims
- 2581US7387689B2Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfacesLAM RES CORP·Filed 2007·Granted Jun 17, 2008·6 cites·20 claims
- 2677US7806126B1Substrate proximity drying using in-situ local heating of substrate and substrate carrier point of contact, and methods, apparatus, and systems for implementing the sameLAM RES CORP·Filed 2005·Granted Oct 5, 2010·5 cites·19 claims
- 2777US7752996B2Apparatus for applying a plating solution for electroless depositionLAM RES CORP·Filed 2006·Granted Jul 13, 2010·4 cites·9 claims
- 2877US6261157B1Selective damascene chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1999·Granted Jul 17, 2001·52 cites·18 claims
- 2976US9058975B2Cleaning solution formulations for substratesKOLICS ARTUR·Filed 2008·Granted Jun 16, 2015·5 cites·11 claims
- 3076US8480810B2Method and apparatus for particle removalFREER ERIK M·Filed 2006·Granted Jul 9, 2013·5 cites·19 claims
- 3176US8133812B2Methods and systems for barrier layer surface passivationDORDI YEZDI·Filed 2009·Granted Mar 13, 2012·4 cites·12 claims
- 3276US7592259B2Methods and systems for barrier layer surface passivationLAM RES CORP·Filed 2006·Granted Sep 22, 2009·4 cites·24 claims
- 3375US9117860B2Controlled ambient system for interface engineeringBOYD JOHN·Filed 2006·Granted Aug 25, 2015·5 cites·13 claims
- 3475US6322427B1Conditioning fixed abrasive articlesAPPLIED MATERIALS INC·Filed 1999·Granted Nov 27, 2001·35 cites·45 claims
- 3574US8623456B2Methods for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2012·Granted Jan 7, 2014·2 cites·11 claims
- 3673US7758404B1Apparatus for cleaning edge of substrate and method for using the sameLAM RES CORP·Filed 2005·Granted Jul 20, 2010·6 cites·12 claims
- 3773US7749893B2Methods and systems for low interfacial oxide contact between barrier and copper metallizationLAM RES CORP·Filed 2006·Granted Jul 6, 2010·3 cites·14 claims
- 3873US7520284B2Apparatus for developing photoresist and method for operating the sameLAM RES CORP·Filed 2005·Granted Apr 21, 2009·4 cites·9 claims
- 3972US8242067B2Two-phase substrate cleaning materialKOROLIK MIKHAIL·Filed 2010·Granted Aug 14, 2012·2 cites·18 claims
- 4072US7625452B2Apparatuses and methods for cleaning a substrateLAM RES CORP·Filed 2008·Granted Dec 1, 2009·2 cites·7 claims
- 4171US9006893B2Devices for metallizationLAM RES CORP·Filed 2013·Granted Apr 14, 2015·2 cites·17 claims
- 4271US8187968B2Methods of post-contact back end of line through-hole via integrationBOYD JOHN·Filed 2009·Granted May 29, 2012·2 cites·15 claims
- 4369US7709400B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2007·Granted May 4, 2010·2 cites·25 claims
- 4468US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 4568US7396430B2Apparatus and method for confined area planarizationLAM RES CORP·Filed 2006·Granted Jul 8, 2008·2 cites·13 claims
- 4667US8388762B2Substrate cleaning technique employing multi-phase solutionFREER ERIK M·Filed 2007·Granted Mar 5, 2013·2 cites·18 claims
- 4767US7648616B1Apparatus and method for semiconductor wafer electroplanarizationLAM RES CORP·Filed 2006·Granted Jan 19, 2010·2 cites·20 claims
- 4866US8323460B2Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removalBOYD JOHN·Filed 2007·Granted Dec 4, 2012·0 cites·31 claims
- 4964US8673769B2Methods and apparatuses for three dimensional integrated circuitsBOYD JOHN·Filed 2007·Granted Mar 18, 2014·2 cites·34 claims
- 5064US8034409B2Methods, apparatuses, and systems for fabricating three dimensional integrated circuitsLAM RES CORP·Filed 2007·Granted Oct 11, 2011·1 cites·30 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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