Inventor · disambiguated record
Huo Yun Duan
Also filed as: DUAN HUO YUN
2 granted patents·10 pending applications·0 citations·filing 2020–2024
27Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC12
Top patents by PatentIndex Score
12 records- 0167US12283559B2Copper wire bond on gold bump on semiconductor die bond padTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 22, 2025·0 cites·24 claims
- 0257US2025336876A1Electronic device with nickel tungsten bottom platingTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0355US2025239462A1Immersion plating process for an integrated circuitTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0454US11515275B2Copper wire bond on gold bump on semiconductor die bond padTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 29, 2022·0 cites·29 claims
- 0553US2025046621A1Ic package with immersion tin on flankTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0648US2025112133A1Packages with stepped conductive terminalsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0747US2025069999A1Dynamic plated metal thickness for semiconductor packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0847US2025006510A1Semiconductor device package with wettable flanksTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0946US2024203838A1Ultra-low thickness semiconductor packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1045US2024250060A1Capillary for stitch bondTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1140US2023275060A1Leaded semiconductor package with lead mold flash reductionTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1240US2024258215A1Wire bonded semiconductor device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →