Inventor · disambiguated record
Hidekazu Matsuura
Also filed as: MATSUURA HIDEKAZU
27 granted patents·2 pending applications·472 citations·filing 1991–2008
97Inventor score
Top patents by PatentIndex Score
29 records- 0186US7061081B2Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 13, 2006·24 cites·24 claims
- 0283US5530860AVirtual computer control system effectively using a CPU with predetermined assignment ratios of resources based on a first and second priority mechanismFUJITSU LTD·Filed 1993·Granted Jun 25, 1996·100 cites·19 claims
- 0379US7479412B2Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 20, 2009·6 cites·13 claims
- 0479US7378722B2Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2006·Granted May 27, 2008·6 cites·25 claims
- 0577US6046072AProcess for fabricating a crack resistant resin encapsulated semiconductor chip packageHITACHI CHEMICAL CO LTD·Filed 1998·Granted Apr 4, 2000·44 cites·14 claims
- 0675US6733880B2Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2001·Granted May 11, 2004·17 cites·25 claims
- 0774US6558791B2Heat-resistant adhesive sheetHITACHI CHEMICAL CO LTD·Filed 2001·Granted May 6, 2003·16 cites·33 claims
- 0871US6700185B1Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1999·Granted Mar 2, 2004·28 cites·20 claims
- 0970US6744133B2Adhesive film for semiconductor, lead frame and semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Jun 1, 2004·16 cites·17 claims
- 1068US6849385B2Photosensitive resin composition, process of forming patterns with the same, and electronic componentsHITACHI CHEMICAL CO LTD·Filed 2002·Granted Feb 1, 2005·10 cites·33 claims
- 1166US7449367B2Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 11, 2008·9 cites·26 claims
- 1266US7057266B2Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·9 cites·20 claims
- 1364US7560307B2Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the sameHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jul 14, 2009·1 cites·6 claims
- 1464US6558500B2Method of producing a lead frame with composite film attached, and use of the lead frameHITACHI CHEMICAL CO LTD·Filed 2001·Granted May 6, 2003·9 cites·40 claims
- 1563US5508357APolyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of polyimidesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 16, 1996·21 cites·3 claims
- 1662US6248613B1Process for fabricating a crack resistant resin encapsulated semiconductor chip packageHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jun 19, 2001·22 cites·13 claims
- 1761US5510425APolyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimidesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 23, 1996·14 cites·2 claims
- 1860US5452462AGlobal communication interrupt control system for communication between real and virtual machine systems using global communication functions of a shared memoryFUJITSU LTD·Filed 1995·Granted Sep 19, 1995·39 cites·29 claims
- 1959US5527621AMethod for surface treatment of polyimide resin molded articlesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Jun 18, 1996·15 cites·10 claims
- 2053US2009053498A1Adhesive film for semiconductor use, metal sheet laminated with adhesive film, wiring circuit laminated with adhesive film, and semiconductor device using same, and method for producing semiconductor deviceMATSUURA HIDEKAZU·Filed 2008·Application pending·0 cites
- 2150US6372080B1Process for fabricating a crack resistant resin encapsulated semiconductor chip packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Apr 16, 2002·17 cites·12 claims
- 2245US5608013APolyimides and thermosetting resin compositions containing the sameHITACHI CHEMICAL CO LTD·Filed 1995·Granted Mar 4, 1997·8 cites·7 claims
- 2341US5291589ASystem for controlling restoration from failure in queue structure of control dataFUJITSU LTD·Filed 1991·Granted Mar 1, 1994·16 cites·5 claims
- 2440US6445076B1Insulating adhesive for electronic parts, and lead frame and semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Sep 3, 2002·10 cites·13 claims
- 2538US5998020AComposite film and lead frame with composite film attachedHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 7, 1999·5 cites·21 claims
- 2636US5955779AMethod of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image removerHITACHI CHEMICAL CO LTD·Filed 1997·Granted Sep 21, 1999·5 cites·3 claims
- 2734US5958653AMethod of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1997·Granted Sep 28, 1999·4 cites·11 claims
- 2834US2005255278A1Adhesive film, lead frame with adhesive film, and semiconductor device using sameMATSUURA HIDEKAZU·Filed 2005·Application pending·0 cites
- 2932US6302991B1Method of producing a lead frame with composite film attached, and use of the lead frameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Oct 16, 2001·1 cites·25 claims
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