Assignee
MATSUURA HIDEKAZU
0 granted patents·2 pending applications·0 citations·filing 2005–2008
Top patents by PatentIndex Score
2 records- 0153US2009053498A1Adhesive film for semiconductor use, metal sheet laminated with adhesive film, wiring circuit laminated with adhesive film, and semiconductor device using same, and method for producing semiconductor deviceMATSUURA HIDEKAZU·Filed 2008·Application pending·0 cites
- 0234US2005255278A1Adhesive film, lead frame with adhesive film, and semiconductor device using sameMATSUURA HIDEKAZU·Filed 2005·Application pending·0 cites
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