Inventor · disambiguated record
David Nicol
Also filed as: NICOL DAVID · NICOL DAVID B
6 granted patents·1 pending application·16 citations·filing 2010–2019
77Inventor score
Files withHARRIS CORP3PRATT & WHITNEY CANADA1REED THOMAS1RENDEK JR LOUIS JOSEPH1WEATHERSPOON MICHAEL1
Top patents by PatentIndex Score
7 records- 0186US8693203B2Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devicesRENDEK JR LOUIS JOSEPH·Filed 2011·Granted Apr 8, 2014·9 cites·11 claims
- 0277US9691698B2Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devicesHARRIS CORP·Filed 2016·Granted Jun 27, 2017·2 cites·24 claims
- 0373US8867219B2Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devicesWEATHERSPOON MICHAEL·Filed 2011·Granted Oct 21, 2014·4 cites·17 claims
- 0467US11248497B2Gas turbine engine yoke and build supportPRATT & WHITNEY CANADA·Filed 2019·Granted Feb 15, 2022·1 cites·14 claims
- 0556US9420687B2Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devicesHARRIS CORP·Filed 2014·Granted Aug 16, 2016·0 cites·18 claims
- 0652US9059317B2Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devicesHARRIS CORP·Filed 2014·Granted Jun 16, 2015·0 cites·22 claims
- 0734US2012098129A1Method of making a multi-chip module having a reduced thickness and related devicesREED THOMAS·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →