Inventor · disambiguated record
Hunglin Chen
Also filed as: CHEN HUNGLIN
7 granted patents·3 pending applications·40 citations·filing 2007–2021
76Inventor score
Files withSHANGHAI HUALI MICROELECT CORP6CHEN SHU-MIN1SEMICONDUCTOR MFG INT SHANGHAI1SHANGAI HUALI MICROELECTRONICS CORP1SHANGHAI HUALI INTEGRATED CIRCUIT CORP1
Top patents by PatentIndex Score
10 records- 0191US8865482B2Method of detecting the circular uniformity of the semiconductor circular contact holesSHANGHAI HUALI MICROELECT CORP·Filed 2013·Granted Oct 21, 2014·37 cites·6 claims
- 0266US11299683B2Liquid fuelCHEN SHU MIN·Filed 2017·Granted Apr 12, 2022·1 cites·18 claims
- 0362US9269639B2Method of detecting and measuring contact alignment shift relative to gate structures in a semicondcutor deviceSHANGHAI HUALI MICROELECT CORP·Filed 2013·Granted Feb 23, 2016·2 cites·11 claims
- 0450US12198061B2Method and apparatus for predicting yield of semiconductor devicesSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2021·Granted Jan 14, 2025·0 cites·19 claims
- 0540US8658438B2Measurement of lateral diffusion of implanted ions in doped well region of semiconductor devicesSHANGHAI HUALI MICROELECT CORP·Filed 2012·Granted Feb 25, 2014·0 cites·8 claims
- 0638US8987013B2Method of inspecting misalignment of polysilicon gateSHANGHAI HUALI MICROELECT CORP·Filed 2013·Granted Mar 24, 2015·0 cites·6 claims
- 0738US2013138239A1Semiconductor yield management systemSHANGHAI HUALI MICROELECT CORP·Filed 2012·Application pending·0 cites
- 0836US2008124891A1Method for Preventing Wafer Edge Peeling in Metal Wiring ProcessSEMICONDUCTOR MFG INT SHANGHAI·Filed 2007·Application pending·0 cites
- 0935US2013137196A1Method for monitoring devices in semiconductor processSHANGHAI HUALI MICROELECT CORP·Filed 2012·Application pending·0 cites
- 1027US9080863B2Method for monitoring alignment between contact holes and polycrystalline silicon gateSHANGAI HUALI MICROELECTRONICS CORP·Filed 2012·Granted Jul 14, 2015·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →