Inventor · disambiguated record
Katsuyoshi Harada
Also filed as: HARADA KATSUYOSHI
42 granted patents·10 pending applications·173 citations·filing 1990–2025
97Inventor score
Files withKOKUSAI ELECTRIC CORP19HITACHI INT ELECTRIC INC15MITSUI CHEMICALS INC8TOAGOSEI CO LTD5TOA GOSEI CHEM IND3
Top patents by PatentIndex Score
52 records- 0196US11527402B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 0293US10770287B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 8, 2020·6 cites·18 claims
- 0393US10040884B2Ethylene/α-olefin copolymers and lubricating oilsMITSUI CHEMICALS INC·Filed 2015·Granted Aug 7, 2018·9 cites·15 claims
- 0493US9620357B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 11, 2017·8 cites·14 claims
- 0591US9443718B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 13, 2016·11 cites·21 claims
- 0690US10329366B2Ethylene/α-olefin copolymers and lubricating oilsMITSUI CHEMICALS INC·Filed 2018·Granted Jun 25, 2019·4 cites·14 claims
- 0789US10340134B2Semiconductor device manufacturing method, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 2, 2019·5 cites·15 claims
- 0888US11817314B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 14, 2023·1 cites·20 claims
- 0988US5362897AProcess for producing trialkoxysilanesTOA GOSEI CHEM IND·Filed 1994·Granted Nov 8, 1994·34 cites·12 claims
- 1087US10490400B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Nov 26, 2019·4 cites·18 claims
- 1186US11961733B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 16, 2024·1 cites·23 claims
- 1285US9190298B2Film forming method and recording medium for performing the methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·5 cites·16 claims
- 1383US12009201B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jun 11, 2024·0 cites·22 claims
- 1481US12288684B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 1578US10607833B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 31, 2020·2 cites·15 claims
- 1676US11164741B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 2, 2021·1 cites·21 claims
- 1775US11664217B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 1873US12424437B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·23 claims
- 1973US5985229ASolid silica derivative and process for producing the sameTOAGOSEI CO LTD·Filed 1996·Granted Nov 16, 1999·33 cites·9 claims
- 2072US11056337B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 2172US2025226207A1Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2271US11978623B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 2371US10604842B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 31, 2020·1 cites·15 claims
- 2471US9881789B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 30, 2018·1 cites·10 claims
- 2570US12334336B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2670US12288683B2Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 29, 2025·0 cites·14 claims
- 2769US2025282983A1Laminate and method for manufacturing laminateMITSUI CHEMICALS INC·Filed 2023·Application pending·0 cites
- 2868US9741555B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 22, 2017·1 cites·18 claims
- 2968US9607827B2Method of manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 28, 2017·1 cites·15 claims
- 3068US9520282B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 13, 2016·1 cites·14 claims
- 3166US9472397B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Oct 18, 2016·1 cites·9 claims
- 3266US9431240B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Aug 30, 2016·1 cites·11 claims
- 3363US6664224B2Quaternary ammonium salt and process for the preparation thereofTOAGOSEI CO LTD·Filed 2001·Granted Dec 16, 2003·4 cites·11 claims
- 3462US7976807B2Method for detoxifying HCD gas and apparatus thereforKANKEN TECHNO CO LTD·Filed 2007·Granted Jul 12, 2011·1 cites·1 claims
- 3562US2025206992A1Laminate, method for producing laminate, and adhesive compositionMITSUI CHEMICALS INC·Filed 2023·Application pending·0 cites
- 3662US2025340048A1Laminate and method for manufacturing laminateMITSUI CHEMICALS INC·Filed 2023·Application pending·0 cites
- 3761US7005532B2Process of producing alkoxysilanesTOAGOSEI CO LTD·Filed 2002·Granted Feb 28, 2006·3 cites·13 claims
- 3861US2024026054A1Graft-modified product, adhesive, olefin resin composition, and laminateMITSUI CHEMICALS INC·Filed 2021·Application pending·0 cites
- 3958US2023365733A1Organosilicon compound graft copolymer and rubber composition for tire including the copolymerMITSUI CHEMICALS INC·Filed 2021·Application pending·0 cites
- 4057US2023411148A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4157US2024249933A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4255US2023093981A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4354US5260471AProcess for producing trialkoxysilaneTOA GOSEI CHEM IND·Filed 1993·Granted Nov 9, 1993·10 cites·17 claims
- 4453US6796874B2Toy vehicle with shock absorbing steering mechanismNIKKO KK·Filed 2001·Granted Sep 28, 2004·3 cites·2 claims
- 4552US10930491B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 23, 2021·0 cites·18 claims
- 4648US7488693B2Method for producing silicon oxide filmTOAGOSEI CO LTD·Filed 2005·Granted Feb 10, 2009·0 cites·19 claims
- 4747US2020071443A1Graft copolymer-containing solid product and use thereofMITSUI CHEMICALS INC·Filed 2017·Application pending·0 cites
- 4846US9460914B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·0 cites·16 claims
- 4942US10290492B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted May 14, 2019·0 cites·18 claims
- 5042US9691606B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 27, 2017·0 cites·17 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →