Inventor · disambiguated record
Man-Lin Chen
Also filed as: CHEN MAN-LIN
9 granted patents·2 pending applications·193 citations·filing 1998–2018
85Inventor score
Top patents by PatentIndex Score
11 records- 0190US6119338AMethod for manufacturing high-density multilayer printed circuit boardsIND TECH RES INST·Filed 1998·Granted Sep 19, 2000·150 cites·9 claims
- 0275US6841266B2Photosensitive insulating film of organic light emitting diode (OLED)IND TECH RES INST·Filed 2002·Granted Jan 11, 2005·24 cites·9 claims
- 0373US6432613B1Photosensitive compositionIND TECH RES INST·Filed 2001·Granted Aug 13, 2002·12 cites·43 claims
- 0468US10759148B2Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the sameIND TECH RES INST·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 0566US10351737B2Wood adhesiveIND TECH RES INST·Filed 2018·Granted Jul 16, 2019·0 cites·10 claims
- 0662US2015232724A1Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the sameIND TECH RES INST·Filed 2014·Application pending·0 cites
- 0760US10190026B2Wood adhesiveIND TECH RES INST·Filed 2016·Granted Jan 29, 2019·0 cites·9 claims
- 0854US8193258B2Sealant compositionJENG JAUDER·Filed 2009·Granted Jun 5, 2012·0 cites·21 claims
- 0954US6632372B1Method of forming via-holes in multilayer circuit boardsIND TECH RES INST·Filed 2000·Granted Oct 14, 2003·7 cites·20 claims
- 1048US9392688B2Biomass photosensitive material and method for manufacturing the same, and printed circuit boardIND TECH RES INST·Filed 2015·Granted Jul 12, 2016·0 cites·20 claims
- 1143US2013084454A1Resin composition, resin and method for manufacturing the sameLIN HSIEN-KUANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →