Inventor · disambiguated record
Michael Huber
Also filed as: HUBER MICHAEL · HUBER MICHAEL L · HUBER MICHAEL LEROY
27 granted patents·4 pending applications·522 citations·filing 1996–2023
96Inventor score
Files withINFINEON TECHNOLOGIES AG8SIEMENS AG8OSRAM OPTO SEMICONDUCTORS GMBH5TEXAS INSTRUMENTS INC4OSRAM OLED GMBH3
Top patents by PatentIndex Score
31 records- 0185USD406822SCarrier element for a semiconductor chip for integration into a chipcard, or a chipcard moduleSIEMENS AG·Filed 1997·Granted Mar 16, 1999·31 cites·1 claims
- 0282US6288904B1Chip module, in particular for implantation in a smart card bodyINFINEON TECHNOLOGIES AG·Filed 1999·Granted Sep 11, 2001·67 cites·17 claims
- 0380US6253635B1Brake pedal configurationSIEMENS AG·Filed 1998·Granted Jul 3, 2001·50 cites·8 claims
- 0478US6188580B1Smart card and semiconductor chip for use in a smart cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 13, 2001·59 cites·16 claims
- 0577US6384425B1Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formedINFINEON TECHNOLOGIES AG·Filed 1998·Granted May 7, 2002·47 cites·5 claims
- 0674US6471304B1Brake value signal transmitter for an electrically controlled and activated brake systemSIEMENS AG·Filed 1998·Granted Oct 29, 2002·30 cites·8 claims
- 0771USD405779SCarrier element for a semiconductor chip for integration into a chipcardSIEMENS AG·Filed 1997·Granted Feb 16, 1999·17 cites·1 claims
- 0870US6191951B1Smart card module and smart card including a smart card moduleINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 20, 2001·39 cites·12 claims
- 0967US9269663B2Single pattern high precision capacitorTEXAS INSTRUMENTS INC·Filed 2013·Granted Feb 23, 2016·2 cites·18 claims
- 1067US6025997AChip module for semiconductor chips having arbitrary footprintsSIEMENS AG·Filed 1998·Granted Feb 15, 2000·35 cites·17 claims
- 1166US6313524B1Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrateINFINEON TECHNOLOGIES AG·Filed 1999·Granted Nov 6, 2001·34 cites·14 claims
- 1266US6185507B1Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unitSIEMENS AG·Filed 1999·Granted Feb 6, 2001·33 cites·7 claims
- 1364US10115869B2Optoelectronic semiconductor chip, optoelectronic component and method for singulating semiconductor chipsOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Oct 30, 2018·2 cites·9 claims
- 1463US10014444B2Optoelectronic semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Jul 3, 2018·1 cites·19 claims
- 1561US10276748B2Radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor chips and optoelectronic component having a radiation-emitting semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2015·Granted Apr 30, 2019·1 cites·10 claims
- 1661US6326683B1Carrier element for a semiconductor chipSIEMENS AG·Filed 1998·Granted Dec 4, 2001·32 cites·13 claims
- 1759US6088901AMethod for producing a carrier element for semiconductor chipsSIEMENS AG·Filed 1998·Granted Jul 18, 2000·24 cites·9 claims
- 1857US7573086B2TaN integrated circuit (IC) capacitorTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 11, 2009·2 cites·19 claims
- 1956US9570662B2Method of encapsulating an optoelectronic device and light-emitting diode chipTAEGER SEBASTIAN·Filed 2012·Granted Feb 14, 2017·1 cites·13 claims
- 2055US5654219AAnnealed poly-silicide etch processTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 5, 1997·15 cites·4 claims
- 2155US2025379183A1Method for producing at least one semiconductor device and semiconductor deviceAMS OSRAM INT GMBH·Filed 2023·Application pending·0 cites
- 2254US2024078406A1Chip assembly, method for forming a chip assembly, and method for using a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2351US12382754B2Optoelectronic semiconductor device comprising an insulating layer and method of manufacturing the optoelectronic semiconductor deviceOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2020·Granted Aug 5, 2025·0 cites·22 claims
- 2451US12051640B2Chip card body, method for forming a chip card body and chip cardINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 30, 2024·0 cites·7 claims
- 2549US11705370B2Semiconductor component having a compressive strain layer and method for producing the semiconductor component having a compressive strain layerOSRAM OLED GMBH·Filed 2019·Granted Jul 18, 2023·0 cites·20 claims
- 2646US9761770B2Optoelectronic semiconductor chip encapsulated with an ALD layer and corresponding method for productionOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Sep 12, 2017·0 cites·18 claims
- 2742US9177181B2Secure epass booklet based on double chip technologyHOEGERL JUERGEN·Filed 2012·Granted Nov 3, 2015·0 cites·15 claims
- 2842US2021303962A1Chip card and method for producing a chip cardINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2941US11476389B2Method for producing an optoelectronic semiconductor chip having structures at the radiation passage surface, and optoelectronic semiconductor chip having structures at the radiation passage surfaceOSRAM OLED GMBH·Filed 2018·Granted Oct 18, 2022·0 cites·17 claims
- 3041US10629486B2Method for producing a plurality of semiconductor chips and semiconductor chipOSRAM OLED GMBH·Filed 2016·Granted Apr 21, 2020·0 cites·14 claims
- 3128US2007048962A1TaN integrated circuit (IC) capacitor formationTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →