Inventor · disambiguated record
Michael Varnau
Also filed as: VARNAU MICHAEL J
2 granted patents·3 pending applications·51 citations·filing 1980–2005
65Inventor score
Top patents by PatentIndex Score
5 records- 0175US6916684B2Wafer-applied underfill processDELPHI TECH INC·Filed 2003·Granted Jul 12, 2005·24 cites·20 claims
- 0263US4309856APanel mounting device and assemblyGEN MOTORS CORP·Filed 1980·Granted Jan 12, 1982·27 cites·2 claims
- 0338US2006273467A1Flip chip package and method of conducting heat therefromDELPHI TECH INC·Filed 2005·Application pending·0 cites
- 0434US2007045840A1Method of solder bumping a circuit component and circuit component formed therebyDELPHI TECH INC·Filed 2005·Application pending·0 cites
- 0532US2005081375A1Printed circuit board assembly and methodFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Michael Varnau files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →