Inventor · disambiguated record
Denise Thienpont
Also filed as: THIENPONT DENISE
2 granted patents·20 citations·filing 2005–2008
60Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND2
Top patents by PatentIndex Score
2 records- 0183US7439100B2Encapsulated chip scale package having flip-chip on lead frame structure and methodSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 21, 2008·13 cites·19 claims
- 0276US7656048B2Encapsulated chip scale package having flip-chip on lead frame structureSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Feb 2, 2010·7 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →