Inventor · disambiguated record
Kouji Tometsuka
Also filed as: TOMETSUKA KOUJI
15 granted patents·4 pending applications·698 citations·filing 1995–2009
94Inventor score
Top patents by PatentIndex Score
19 records- 0195US6527884B1Hydrogen annealing process and apparatus thereforHITACHI INT ELECTRIC INC·Filed 2000·Granted Mar 4, 2003·428 cites·12 claims
- 0287US6780251B2Substrate processing apparatus and method for fabricating semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Aug 24, 2004·40 cites·6 claims
- 0384US5669644AWafer transfer plateKOKUSAI ELECTRIC CO LTD·Filed 1995·Granted Sep 23, 1997·90 cites·16 claims
- 0481US6251189B1Substrate processing apparatus and substrate processing methodKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Jun 26, 2001·25 cites·12 claims
- 0577US6712909B2Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Mar 30, 2004·17 cites·4 claims
- 0675US6482753B1Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Nov 19, 2002·18 cites·5 claims
- 0773US6495473B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Dec 17, 2002·12 cites·4 claims
- 0863US6540465B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2001·Granted Apr 1, 2003·9 cites·23 claims
- 0961US7003219B2Substrate processing methodHITACHI INT ELECTRIC INC·Filed 2004·Granted Feb 21, 2006·5 cites·18 claims
- 1060US8173214B2Substrate processing methodTOMETSUKA KOUJI·Filed 2009·Granted May 8, 2012·1 cites·2 claims
- 1160US6318944B1Semiconductor fabricating apparatus, method for modifying positional displacement of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassetteKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Nov 20, 2001·32 cites·10 claims
- 1259US6332898B1Substrate processing apparatus and maintenance method thereforKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Dec 25, 2001·6 cites·25 claims
- 1352US7553518B2Substrate processing methodHITACHI INT ELECTRIC INC·Filed 2005·Granted Jun 30, 2009·0 cites·15 claims
- 1449US6143040ASubstrate processing apparatus and maintenance method thereforKOKUSAI ELECTRIC CO LTD·Filed 1998·Granted Nov 7, 2000·13 cites·23 claims
- 1548US6923867B2Substrate processing apparatus and method for manufacturing semiconductor deviceSONY CORP·Filed 2002·Granted Aug 2, 2005·2 cites·10 claims
- 1641US2002014311A1Substrate processing apparatus and methodHITACHI INT ELECTRIC INC·Filed 2001·Application pending·0 cites
- 1736US2002034595A1Substrate processing equipment and method and covering member for use thereinFiled 2001·Application pending·0 cites
- 1836US2002132497A1Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 1935US2001029108A1Substrate processeing apparatus, substrate processing method and electronic device manufacturing methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →