Inventor · disambiguated record
Sun-Oo Kim
Also filed as: KIM SUN-JUNG · KIM SUN-O · KIM SUN-OO
25 granted patents·5 pending applications·445 citations·filing 1998–2016
96Inventor score
Files withINFINEON TECHNOLOGIES AG17KIM SUN-OO4SAMSUNG ELECTRONICS CO LTD3CHAE MOOSUNG1HYUNDAI ELECTRONICS IND1
Top patents by PatentIndex Score
30 records- 0194US6087278AMethod for fabricating semiconductor devices having an HDP-CVD oxide layer as a passivation layerHYUNDAI ELECTRONICS IND·Filed 1999·Granted Jul 11, 2000·259 cites·16 claims
- 0291US8004066B2Crack stop and moisture barrierINFINEON TECHNOLOGIES AG·Filed 2010·Granted Aug 23, 2011·15 cites·21 claims
- 0391US7741715B2Crack stop and moisture barrierINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 22, 2010·25 cites·18 claims
- 0490US7626268B2Support structures for semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 1, 2009·18 cites·38 claims
- 0589US7795615B2Capacitor integrated in a structure surrounding a dieINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 14, 2010·19 cites·25 claims
- 0683US7235454B2MIM capacitor structure and method of fabricationINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 26, 2007·12 cites·16 claims
- 0783US7052990B2Sealed pores in low-k material damascene conductive structuresINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 30, 2006·35 cites·20 claims
- 0881US7879681B2Methods of fabricating three-dimensional capacitor structures having planar metal-insulator-metal and vertical capacitors thereinSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 1, 2011·10 cites·1 claims
- 0973US7939942B2Semiconductor devices and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 10, 2011·5 cites·24 claims
- 1070US9437593B2Silicided semiconductor structure and method of forming the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 6, 2016·2 cites·19 claims
- 1166US7365025B2Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 29, 2008·2 cites·11 claims
- 1265US9194036B2Plasma vapor depositionKIM SUN-OO·Filed 2007·Granted Nov 24, 2015·2 cites·46 claims
- 1363US7960811B2Semiconductor devices and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 14, 2011·2 cites·24 claims
- 1462US7235472B2Method of making fully silicided gate electrodeINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 26, 2007·10 cites·46 claims
- 1560US7858448B2Method of forming support structures for semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2009·Granted Dec 28, 2010·1 cites·20 claims
- 1656US7112507B2MIM capacitor structure and method of fabricationINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 26, 2006·7 cites·31 claims
- 1755US9425140B2Capacitors in integrated circuits and methods of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 23, 2016·0 cites·22 claims
- 1854US10008560B2Capacitors in integrated circuits and methods of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 26, 2018·0 cites·35 claims
- 1954US7041574B2Composite intermetal dielectric structure including low-k dielectric materialINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 9, 2006·5 cites·14 claims
- 2051US8817451B2Semiconductor devices and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 26, 2014·0 cites·19 claims
- 2148US7732315B2Methods of fabricating semiconductor devices and structures thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 8, 2010·0 cites·25 claims
- 2247US8298730B2Semiconductor devices and methods of manufacturing thereofPARK O SEO·Filed 2011·Granted Oct 30, 2012·0 cites·3 claims
- 2347US8197660B2Electro chemical deposition systems and methods of manufacturing using the sameCHAE MOOSUNG·Filed 2007·Granted Jun 12, 2012·0 cites·20 claims
- 2445US2009057826A1Semiconductor Devices and Methods of Manufacture ThereofKIM SUN-OO·Filed 2007·Application pending·0 cites
- 2545US2008173538A1Method and apparatus for sputteringKIM SUN-OO·Filed 2007·Application pending·0 cites
- 2644US5968156AProgrammable peripheral component interconnect (PCI) bridge for interfacing a PCI bus and a local bus having reconstructable interface logic circuit thereinSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 19, 1999·16 cites·3 claims
- 2739US2004245602A1Method of fabricating metal-insulator-metal capacitor (MIM) using lanthanide-doped HfO2Filed 2004·Application pending·0 cites
- 2839US2004248400A1Composite low-k dielectric structureFiled 2003·Application pending·0 cites
- 2937US8748257B2Semiconductor devices and methods of manufacture thereofKIM SUN-OO·Filed 2011·Granted Jun 10, 2014·0 cites·20 claims
- 3036US2001023126A1Method for manufacturing interlayer dielectric layer in semiconductor deviceFiled 2000·Application pending·0 cites
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