Inventor · disambiguated record
Se-Jin Shim
Also filed as: SHIM SE-JIN
9 granted patents·193 citations·filing 1996–2003
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0190US6218260B1Methods of forming integrated circuit capacitors having improved electrode and dielectric layer characteristics and capacitors formed therebySAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Apr 17, 2001·76 cites·26 claims
- 0269US6624069B2Methods of forming integrated circuit capacitors having doped HSG electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 23, 2003·12 cites·46 claims
- 0367US5943584AAnnealing methods of doping electrode surfaces using dopant gasesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 24, 1999·35 cites·21 claims
- 0467US5622889AHigh capacitance capacitor manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 22, 1997·27 cites·5 claims
- 0553US6876029B2Integrated circuit capacitors having doped HSG electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 5, 2005·4 cites·14 claims
- 0652US6087226AMethods of forming capacitors including electrodes with hemispherical grained silicon layers on sidewalls thereof and related structuresSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 11, 2000·13 cites·11 claims
- 0750US5943570AMethods of forming capacitor electrodes containing HSG semiconductor layers thereinSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 24, 1999·12 cites·6 claims
- 0847US6004858AMethods of forming hemispherical grained silicon (HSG-Si) capacitor structures including protective layersSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 21, 1999·10 cites·29 claims
- 0935US6245632B1Variable temperature methods of forming hemispherical grained silicon (HSG-Si) layersSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jun 12, 2001·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →