Inventor · disambiguated record
Fee Hoon Wendy Wong
Also filed as: WONG FEE HOON · WONG FEE HOON WENDY
1 granted patent·3 pending applications·5 citations·filing 2008–2022
26Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0163US8410586B2Semiconductor package and method of assembling a semiconductor packageRIEDL EDMUND·Filed 2008·Granted Apr 2, 2013·5 cites·24 claims
- 0257US2023197585A1Semiconductor package interconnect and power connection by metallized structures on package bodyINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 0344US2023170329A1Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0443US2023178428A1Leaded semiconductor package formation using lead frame with structured central padINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →