Inventor · disambiguated record
Iwao Higashikawa
Also filed as: HIGASHIKAWA IWAO
28 granted patents·2 pending applications·727 citations·filing 1979–2009
97Inventor score
Top patents by PatentIndex Score
30 records- 0195US6333138B1Exposure method utilizing partial exposure stitch areaTOSHIBA KK·Filed 2000·Granted Dec 25, 2001·76 cites·8 claims
- 0291US6765673B1Pattern forming method and light exposure apparatusTOSHIBA KK·Filed 2000·Granted Jul 20, 2004·42 cites·21 claims
- 0385US5851842AMeasurement system and measurement methodTOSHIBA KK·Filed 1997·Granted Dec 22, 1998·86 cites·22 claims
- 0485US5326672AResist patterns and method of forming resist patternsSORTEC CORP·Filed 1992·Granted Jul 5, 1994·49 cites·13 claims
- 0582US6333493B1Heat treating method and heat treating apparatusTOSHIBA KK·Filed 2000·Granted Dec 25, 2001·20 cites·3 claims
- 0679US5767521AElectron-beam lithography system and method for drawing nanometer-order patternTOSHIBA KK·Filed 1995·Granted Jun 16, 1998·68 cites·22 claims
- 0779US5629115AExposure mask and method and apparatus for manufacturing the sameTOSHIBA KK·Filed 1996·Granted May 13, 1997·33 cites·60 claims
- 0879US5374502AResist patterns and method of forming resist patternsSORTEC CORP·Filed 1993·Granted Dec 20, 1994·34 cites·2 claims
- 0978US5907393AExposure mask and method and apparatus for manufacturing the sameTOSHIBA KK·Filed 1996·Granted May 25, 1999·32 cites·17 claims
- 1077US6340542B1Method of manufacturing a semiconductor device, method of manufacturing a photomask, and a master maskTOSHIBA KK·Filed 1999·Granted Jan 22, 2002·36 cites·15 claims
- 1176US5969428AAlignment mark, manufacturing method thereof, exposing method using the alignment mark, semiconductor device manufactured using the exposing methodTOSHIBA KK·Filed 1998·Granted Oct 19, 1999·43 cites·3 claims
- 1276US5847468AAlignment mark for use in making semiconductor devicesTOSHIBA KK·Filed 1997·Granted Dec 8, 1998·43 cites·14 claims
- 1374US5728494AExposure mask and method and apparatus for manufacturing the sameTOSHIBA KK·Filed 1996·Granted Mar 17, 1998·26 cites·4 claims
- 1474US4473437ADry etching method for organic material layersTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Sep 25, 1984·36 cites·6 claims
- 1571US6635549B2Method of producing exposure maskTOSHIBA KK·Filed 2001·Granted Oct 21, 2003·11 cites·14 claims
- 1669US6319637B1Method for forming patternTOSHIBA KK·Filed 2000·Granted Nov 20, 2001·10 cites·20 claims
- 1761US6483083B2Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surfaceTOSHIBA KK·Filed 2001·Granted Nov 19, 2002·7 cites·11 claims
- 1859US6542237B1Exposure method for making precision patterns on a substrateTOSHIBA KK·Filed 2000·Granted Apr 1, 2003·5 cites·10 claims
- 1959US6265696B1Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surfaceTOSHIBA KK·Filed 1999·Granted Jul 24, 2001·21 cites·9 claims
- 2058US6680462B2Heat treating method and heat treating apparatusTOSHIBA KK·Filed 2002·Granted Jan 20, 2004·4 cites·2 claims
- 2157US6040114APattern forming methodTOSHIBA KK·Filed 1997·Granted Mar 21, 2000·12 cites·10 claims
- 2255US6495807B2Heat treating method and heat treating apparatusTOSHIBA KK·Filed 2001·Granted Dec 17, 2002·3 cites·3 claims
- 2349US4510173AMethod for forming flattened filmTOSHIBA KK·Filed 1984·Granted Apr 9, 1985·14 cites·14 claims
- 2449US2010081091A1Method for manufacturing semiconductor deviceHASHIMOTO KOJI·Filed 2009·Application pending·0 cites
- 2542US6806941B2Pattern forming method and pattern forming apparatusTOSHIBA KK·Filed 2001·Granted Oct 19, 2004·0 cites·8 claims
- 2641US6335145B1Pattern forming method and pattern forming apparatusTOSHIBA KK·Filed 2000·Granted Jan 1, 2002·0 cites·7 claims
- 2741US4264715AMethod of preparing resist patternVLSI TECHNOLOGY RES ASS·Filed 1979·Granted Apr 28, 1981·6 cites·7 claims
- 2839US2009141378A1Optical element and optical apparatusTAWARAYAMA KAZUO·Filed 2008·Application pending·0 cites
- 2938US6165652APattern forming method and pattern forming apparatusTOSHIBA KK·Filed 1999·Granted Dec 26, 2000·3 cites·2 claims
- 3036US5262282APattern forming methodTOSHIBA KK·Filed 1992·Granted Nov 16, 1993·7 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →